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- mode I dynamic growing crack Ⅰ型动态扩展裂纹
- mode I dynamic crack Ⅰ型动态裂纹
- Mode I requires Gs interface between the SGSN and MSC/HLR. 模式I需要基于SGSN和MSC/HLR之间的界面运行。
- The BSC supports network operation modes I and II. BSC支持网路运行模式I和II。
- Modal acoustic emission (MAE) that uses the energy produced by the growing crack for detection without scanning has shown its conspicuous advantage. 模态声发射由于无需扫查工件而利用裂纹生长产生的能量来实现检测，从而显示了极大的优越性。
- In this paper the fracture analysis on Mode I crack in orthotropic functional gradient materials is carefully studied. 重点对含I型裂纹正交异性功能梯度材料板的应力场和位移场进行理论分析。
- Following the theory of linear piezoelectricity,we consider the Mode I crack in a piezoelectric strip using impermeable boundary condition. 基于线性压电理论,采用电绝缘边界条件,对压电板条中的张开型(I型)裂纹问题进行了求解。
- Job Description: SDC seeks high-energy Compensation Professionals who want to be a part of a dynamic growing software a...... ... 公司名称：尚瑞薪才信息技术（上海）有限公司工作地点：上海市浦东新区发布时间：2009-7-10
- It is found that the size and the shape of the parabolic crack affect the mode I stress intensity factor at the crack tips. 参数分析表明轴对称抛物线曲裂纹尖端的应力强度因子与抛物线曲裂纹的尺寸和形状有关。
- It is found that the shape of the mode I plastic zone is similar to that obtained by von Mises or Tresca yielding criterion but leaning forward from the crack tip. 结果表明，与宏观断裂力学算出的塑性区形状相比，本文给出的塑性区向裂纹前方倾斜；
- The dynamically growing and falling drops serve as windowless optical cells. 基于此基本原理,利用连续动态液滴荧光法测定溶液中的痕量过氧化氢。
- In this article,the fracture analysis on mode I crack of orthotropic functionally gradient materials is studied,under which the elastic constants changed exponentially along thickness of the plate. 文章对含I型裂纹的正交各向异性功能梯度材料板沿其板厚的弹性常数表达式呈指数函数变化时的应力-应变场进行分析。
- In casing cementing of Caogu 1 Qianshan reservior, lost circulation is encountered due to growing cracked holes. 胜利油田草古1潜山稠油油藏缝洞十分发育，导致固井过程中水泥浆严重漏失。
- It is found that, for mode I cracks, the precision of photoelasticity technique is hi gher than that of caustic method. 以光弹性法及焦散线法的基本原理为基础,对两种方法在确定应力强度因子方面进行了比较。
- Mode I Crack Problem in Piezoelectric Strip 压电板条中的平面裂纹问题
- Based on the finite element method, the maximum circumferential stress and stress intensity factor near the tip of mode I V-notch added coating are analyzed numerically. 摘要基于有限元法，对添加涂层后的I型V形切口尖端附近的最大周向应力和应力强度因子进行了数值分析。
- Here, a micromechanical model is proposed to determine the opening mode (Mode I) delamination fracture toughness of a unidirectionally reinforced material. 本研究提出一个微机械模型来决定单向加强的复合材料开口式（模式一）脱层破坏的韧性。
- My letter will convey some idea of my mode of life. 我的信将使你了解到一些我的生活方式。
- The compiler now dynamically grows the heaps as necessary, only requiring a fixed size for the memory allocated to the precompiled header. 编译器现在可以根据需要使堆动态增大,只要求分配给预编译头的内存的大小固定不变。
- Furthermore, the tendencies of the Mode I SIF and the EDIF are variable for different combinations of bimaterials, while the Mode II SIF almost keeps constant against different electric fields. 另外，对于不同的双压电材料而言，其I型应力强度因子和电位移强度因子随外载荷变化的趋势也不同，只有II型应力强度因子基本不随电场的变化而变化。
