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- mode I dynamic crack Ⅰ型动态裂纹
- mode I dynamic growing crack Ⅰ型动态扩展裂纹
- Mode I requires Gs interface between the SGSN and MSC/HLR. 模式I需要基于SGSN和MSC/HLR之间的界面运行。
- The BSC supports network operation modes I and II. BSC支持网路运行模式I和II。
- In this paper the fracture analysis on Mode I crack in orthotropic functional gradient materials is carefully studied. 重点对含I型裂纹正交异性功能梯度材料板的应力场和位移场进行理论分析。
- Analyses of dynamic crack propagation and crack arrest for a specified initial flaw size, external geometry, and applied load can be conducted in either of two different ways. 为特定的初始裂纹尺寸、外部几何形状和应用载荷对动态裂纹扩展和裂停止进行分析,可以用两种不同方法中的任何一种来进行。
- Following the theory of linear piezoelectricity,we consider the Mode I crack in a piezoelectric strip using impermeable boundary condition. 基于线性压电理论,采用电绝缘边界条件,对压电板条中的张开型(I型)裂纹问题进行了求解。
- It is found that the size and the shape of the parabolic crack affect the mode I stress intensity factor at the crack tips. 参数分析表明轴对称抛物线曲裂纹尖端的应力强度因子与抛物线曲裂纹的尺寸和形状有关。
- It is found that the shape of the mode I plastic zone is similar to that obtained by von Mises or Tresca yielding criterion but leaning forward from the crack tip. 结果表明,与宏观断裂力学算出的塑性区形状相比,本文给出的塑性区向裂纹前方倾斜;
- Perhaps the simplest illustration of the role of stress waves in dynamic crack propagation and crack arrest is given by the one-dimensional analysis of the double torsion specimen. 也许最简单地说明在动态裂纹扩展和止裂中应力波的规律是由双扭(DT)试件的一维分析给出的。
- In this paper, a simple formula is derived for calculating the dynamic stress intensity factor (DSIF)of three point bending specimen using dynamic crack opening displacement (DCOD). 给出了一种由裂纹的动态张开位移计算三点弯曲试样的动态应力强度因子的简单方法。
- This article has described the development of putty for exterior w al l in China, and the necessity of establishing the requirement of “dynamic crack resistance”in the new standard. 介绍了我国外墙腻子的发展,新标准中“动态抗开裂性”制定的必要性。
- In this article,the fracture analysis on mode I crack of orthotropic functionally gradient materials is studied,under which the elastic constants changed exponentially along thickness of the plate. 文章对含I型裂纹的正交各向异性功能梯度材料板沿其板厚的弹性常数表达式呈指数函数变化时的应力-应变场进行分析。
- It is found that, for mode I cracks, the precision of photoelasticity technique is hi gher than that of caustic method. 以光弹性法及焦散线法的基本原理为基础,对两种方法在确定应力强度因子方面进行了比较。
- Based on the boundary variational theorem, the energy release quantity and energy release rate(dynamical crack extension force)along the crack boundary are obtained. 由此求得动态裂纹扩展时,沿裂纹边界的能量释放量和能量释放率(动态裂纹扩展力)。
- Mode I Crack Problem in Piezoelectric Strip 压电板条中的平面裂纹问题
- Based on the finite element method, the maximum circumferential stress and stress intensity factor near the tip of mode I V-notch added coating are analyzed numerically. 摘要基于有限元法,对添加涂层后的I型V形切口尖端附近的最大周向应力和应力强度因子进行了数值分析。
- Here, a micromechanical model is proposed to determine the opening mode (Mode I) delamination fracture toughness of a unidirectionally reinforced material. 本研究提出一个微机械模型来决定单向加强的复合材料开口式(模式一)脱层破坏的韧性。
- My letter will convey some idea of my mode of life. 我的信将使你了解到一些我的生活方式。
- Furthermore, the tendencies of the Mode I SIF and the EDIF are variable for different combinations of bimaterials, while the Mode II SIF almost keeps constant against different electric fields. 另外,对于不同的双压电材料而言,其I型应力强度因子和电位移强度因子随外载荷变化的趋势也不同,只有II型应力强度因子基本不随电场的变化而变化。