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- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此,有必要对这种混合焊点进行可靠性分析。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- Analyse the failure modes and mechanism of the mixed solder joint,and introduce the effect factors of reliability ulteriorly. 对混合焊点的失效形式和混合焊点的失效机理进行了分析,并进一步介绍了影响这类焊点可靠性的因素。
- The analysis results show that process is the most important effect factor for the prophase reliability of mixed solder joint, and environment is the most important effect factor for the anaphase reliability of mixed solder joint. 分析结果显示,工艺对混合焊点的前期可靠性影响最大,环境对混合焊点的后期可靠性影响最大。
- Reliability Analysis of Backwards Compatible Mixed Solder Joint 向后兼容混合焊点的可靠性分析
- Reliability study of BGA mixed solder joint under thermal cycle BGA混合焊点热循环负载下的可靠性研究
- mixed solder joints 混合焊点
- Mixed solder joint 混合焊点
- Heat solder joints only to the point were solder will flow properly. Excessive heat may distort brass castings. 热焊料连接只能用在焊料能够正确流动的地方。过热可能扭曲黄铜铸件。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives. 改善后的颗粒结构还能够让焊锡结合点的光洁度明显优于传统的无铅合金替代品。
- Q: Will IPC be publishing a new specification for inspection of lead-free solder joints? IPC是否会颁布新的关于无铅焊接的质检标准?
- Thermal fatigue life of solder joints is predicted using the Coffin-Manson's empirical modified formula. 在此基础上,利用Coffin-Manson经验修正公式预报了焊点的热疲劳寿命。
- It is shown that 96.8 percent of defects inside solder joints are inspec-ted successfully. 结果表明;对盘焊缺陷的检测成功率达96.;8%25。
- Atoms in the solder joints move as a result of both diffusion and electromigration. 另一方面,扩散和电迁移效应,则造成焊点中的原子移动。
- However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi. 但是,在共晶锡铋焊点中,组成的元素为锡和铋而非单一元素。
- The resulting solder joints have demonstrated improvements in grain structure and have shown a marked increase in reliability. 得到的焊点的晶粒结构得以改善,焊点的可靠性得到了显著提高。
- This flux's finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. 该类型焊剂具有精心研制的活化配系,可以提供现有无挥发性有机物液体助焊剂技术中最佳的熔湿能力和最光亮的焊接点。
- Nitrogen like in the tin-lead system will offer smoother solder joints and better wetting will be gained with the use of nitrogen. 与锡-铅系统类似,氮气可以使焊点更为光滑;使用氮气还可以得到更好的熔湿性。
- At solder joints, different materials are brought into contact, and there are compositional gradients at the interfaces. 不同的材料在焊点相互接触,因此在界面处会存在著组成之浓度梯度。