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- In the fabrication of multiplayer microwave devices, low temperature firing microwave dielectric materials are needed in order to use the low-melting point conductors such as Cu and Ni etc. 在制备多层微波元件过程中,为使用Cu、Ni等低熔点导体,必须降低微波介质陶瓷的烧结温度。
- microwave dielectric materials 微波介质材料
- Preparation of the microwave dielectric ceramics by sol-gel method. 法制备微波介质陶瓷材料。
- Abstract: Microwave dielectric ceramics can miniaturize the wireless communication and other microwave devices. 摘要： 微波介质陶瓷可使微波通信和其他微波设备小型化，是有良好发展前景的一种介电材料。
- In addition, some suggestions in the field of the interfaces of microwave dielectric ceramics were also proposed. 最后指出了在微波介质陶瓷界面研究领域面临的问题及今后的发展方向。
- The crystal structure and microwave dielectric properties of (Pb_(0.48)Ca_(0.52) ) (Fe_(0.5)Nb_(0.5))O_3 ceramics added with CeO_2 was investigated. 研究了CeO2添加量对(Pb0.;48Ca0
- Microwave dielectric ceramics of(1?x)Ba4Sm9.33Ti18O54?xCa0.61Nd0.26TiO3[(1?x)BST?xCNT] were prepared by solid statereaction. 采用固相合成法制备了(1?x)Ba4Sm9.;33Ti18O54?xCa0
- The influences of doping,sintering aids and grain-orientation on the microwave dielectric properties of BaO-Ln2O3-xTiO2 ceramics were summarized. 叙述了BaO-Ln2O3-xTiO2系陶瓷的掺杂、添加烧结助剂和晶粒取向对其烧结温度和微波介电性能的影响。
- dielectric materials for microwave resonator 微波谐振器介质材料
- The glass-forming,the crystallization process and microwave dielectric properties of MgO-Al_2O_3-SiO_2-Ti_2 system glass adding CeO_2 were investigated by mean of DTA,XRD,SEM. 通过DTA、XRD、SEM 等测试手段,研究了CeO_2t 添加到MgO-Al_2O_3-SiO_2-TiO_2系统后玻璃的形成、相变和介电性能。
- The emphasis is laid on dielectric materials,frequence tuning property of DRO, optimization of phase noise,widening of DRO designs,welding,and reliability. 重点介绍了介质材料、DRO的频率调谐特性、相位噪声性能的优化、DRO的拓展设计以及焊封和可靠性。
- Ceramic thermal resistor,voltage-sensitive resistor,MLC,PZT high perfomance ceramic dielectric materials,optical glass,sintered carbides,etc. 热敏陶瓷电阻、压敏电阻MLC、PZT等，高性能陶瓷介质材料，也用于制造超硬合金，光学玻璃等。
- X8R MLCC dielectric materials,which can be applied to both Pd/Ag and Ni inner electrodes,were obtained by adopting appropriate Yb/Mg ratio and sintered atmosphere. 在不同的气氛烧结条件下,通过适当调整Yb/Mg掺杂量,可获得既适用于Pd/Ag内电极又适用于Ni内电极且满足在-55~+150℃范围内,容量随温度的变化率满足±15%25内(X8R)特性要求的多层陶瓷电容器(MLCC)介质材料。
- The time-resolved spectra of free and shallow-trapped photoelectron are obtained by microwave dielectric spectrum detection technology for pure and reduction sensitized AgCl emulsion. 利用微波介电检测技术,测得还原增感立方体氯化银乳剂中自由光电子与浅束缚光电子衰减行为随还原增感温度的变化。
- So far the material of radome limits only in the use of dielectric material. 到目前为止,天线罩的材料仅限于电介质材料。
- For non-direct type application, choice of Dielectric material is important. 对于非直接接触式的应用来说，绝缘介质材料的选择是很重要的。
- This paper introduces basic technology of copper interconnect, including single and dual damascene technology, CMP technology, low k dielectric materials, barrier materials and reliability of copper interconnect. 文中介绍了基本的铜互连布线技术 ,包括单、双镶嵌工艺 ,CMP工艺 ,低介电常数材料和阻挡层材料 ,及铜互连布线的可靠性问题
- ZST microwave dielectric ceramics ZST微波介质陶瓷
- Microwave Dielectric Integrated Circuit 微波绝缘体综合电路
- In this paper, the Damascene Cu interconnecting integration technology, low-k dielectric materials and barrier materials in Cu interconnecting integration technology are introduced. 论述了铜互连技术中低k介质材料、势垒层材料以及铜互连布线的大马士革工艺.
