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- micro ultrasonic bonding 微超声键合
- Abstract: This paper reviews the development of ultrasonic bonding transducer, specially the development in China. 文章摘要: 回顾了超声键合用换能器的发展状况，特别是在我国的研究状况。
- YU Bin, ZHAO Wan-sheng, DI Shi-chun, et al.Study on micro ultrasonic EDM of shaped holes [J].Microfabrication Technology, 2003, ( 1 ) : 44 - 50. [2]于滨;赵万生;狄士春;等.;异形孔的微细超声电火花加工技术研究[J]
- Xi-Qing Sun , T.Masuzawa , M.Fjino ,” Micro ultrasonic machining and its applications in MEMS”, Sensors and actuators, A57 , pp159-164 , 1996. 卓汉明著，“钛合金之微细放电加工特性研究”，国立中央大学博士论文，民国88年。
- Takeshi Morita,Minoru Kuribayashi Kurosawa,Toshiro Higuchi.A micro ultrasonic motor fabricated by hydrothermal method[C].1998 IEEE Ultrasonic Symposium. 上羽贞行;富川义郎.;超声波马达理论与应用[M]
- Methods used in the study of ultrasonic bonding transducer are summarized, such as equivalent network, direct solution of the vibration and wave equations, and finite element method （FEM）. 对超声键合用换能器的研究方法进行了总结，例如等效网络法、直接解振动与波动方程法、有限元法。
- Experimental results can be used to model a real ultrasonic bonder and optimize its functions. 这些均有助于键合机换能系统的工艺建模和优化。
- Ultrasonic Bonding Study of Thick Film Spun Gold and Gold Conductor 厚膜金丝与金导体的超声键合研究
- Non-steady characteristics of ultrasonic bonding transducer system 超声键合换能系统的非稳态特性试验
- The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy(SEM) with Energy Dispersive X-Ray Spectrometer(EDX). 本文采用电子扫描电镜(SEM)及X射线能谱(EDX)分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。
- Microstructure Characteristics at the Ultrasonic Bond Interface 热声键合界面的微观结构特性
- Advavces of Bending Rotation Micro Ultrasonic Motor at Home and Abroad 国内外弯曲旋转微超声马达研究新进展
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- This glue makes a good firm bond. 这种胶水粘得很结实。
- The doctors gave him an ultrasonic brain scan. 医生给他做了脑部超声波扫描检查。
- Common tastes form a bond between the two men. 共同的爱好使两人结交为朋友。
- The Application of Heat Ultrasonic Bonding in the Electronic Package Field 热声焊机在电子封装业中的应用
- How fast does the new micro process the data? 这新微型计算机处理数据有多快?
- The bond that binds the smugglers together is a rope of sand. 把走私犯联接起来的是条沙做的绳子，一碰就碎。
