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- metal lead frame 金属引线架
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- Using potted trial, the soil heavy metal lead pollution influences on maize plant growth were studied under lime ameliorant condition. 摘要采用盆栽试验，研究了在施用石灰改良的条件下，土壤重金属铅污染对玉米生长的影响。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- Extraction of metal lead by smelting floated galena concentrate is conventional process.The produced gas in this process polluts surroundings. 从方铅矿精矿中提取铅多采用传统的火法工艺,得到的是金属铅,然后再加工成相应的铅盐。
- The Greeks and Romans used metallic lead for drawing faint lines. 古希腊和古罗马人使用金属铅来画暗淡的线。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀：卷对卷电镀，接触器件电镀，引线框架电镀，电抛光，选择性点镀等
- Objective: To study the effects of clarificant chitosan on contents of zinc,manganese,calcium and heavy metal lead in the water extraction liquid of chinese herbal medicines. 目的:探讨壳聚糖絮凝澄清剂用于精制中药水提液时对锌、锰、钙及重金属元素铅的影响。
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引线框架电镀层的质量直接影响着钽电容器的可焊性,所以引线框架电镀层质量的测定方法至关重要。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为：抗拉强度在600MPa以上，显微硬度大于180HV，导电率大于80%25IACS。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。
- Handle the battery pack very carefully. Avoid touching the metal leads on the connector of the battery case. 请谨慎处理电池组。避免接触电池组外壳连结埠上的金属接点。
- The metal frame tends to twist under pressure. 这种金属框受压後容易变形。
- The lime control effects are represent on plant high, leaves area, root cubage and others for maize plant growth influenced by heavy metal lead, and the differences are prominent between meliorative treatment and single lead pollution treatment. 石灰对重金属铅影响玉米生长的抑制效应表现在株高、叶面积、根容积等，改良处理与单一铅污染的处理差异显著。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。
- The frame of the umbrella is made of metal. 伞的骨架是金属制的。
