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- The analytical results provide theoretical guide to design CMP equipment, select the kinematic variables of CMP and further understand the material removal mechanism of wafer in CMP. 研究结果为设计CMP机床,选择CMP的运动参数和进一步理解CMP的材料去除机理提供了理论依据。
- The dominant material removal mechanisms in grinding of PCD are abrasive wear, fragmentation, thermal-physics and thermal-chemical process. PCD材料去除主要是通过磨粒的机械磨耗、破碎作用和热物理、热化学作用等方式。
- Research on material removal mechanism of fluid jet polishing 液体喷射抛光材料去除机理的研究
- Analysis on the Supersonic Vibration Gear Honing Materials Removing Mechanism 超声振动珩齿材料去除机理的初步分析
- material removing mechanism 材料去除机理
- Analysis of material removal mechanism in fluid jet polishing by finite element method 液体喷射抛光技术材料去除机理的有限元分析
- Non-continuum Material Removal Mechanism of Surface Polishing with Ultra Precision 超精密抛光材料的非连续去除机理
- Investigation on Material Removal Mechanism for Abrasive Jet Precision Finishing with Grinding Wheel as Restraint 砂轮约束磨粒喷射精密光整加工材料去除机理研究
- Scraps or material removed when something is trimmed. 剪削,废料从被修剪的东西上掉下来的碎屑
- A stray light removing mechanism is designed for improving image contrast and image deblurring in a spaceborne camera. 针对空间相机中的杂光会引起像质模糊和对比度下降问题,设计了空间相机消杂光机构。
- Study on Material Removal Mechanism of Wafer Chemical Mechanical Polishing in IC Manufacturing IC制造中硅片化学机械抛光材料去除机理研究
- Keywords chemical mechanical polishing;planarization;material removal mechanism;model;integrate circuit; 化学机械抛光;平坦化;材料去除机制;模型;集成电路;
- material remove mechanism 材料去除机理
- material removal mechanism 材料去除机理
- Recent Progress in Study on Material Removal Mechanisms of Silicon Wafer During Chemical Mechanical Polishing 半导体芯片化学机械抛光过程中材料去除机理研究进展
- Floationg material removal of semi clean water and sewage, waste, dirty water. 用于去除生活用下水,废水,污水中的浮游物质。
- The material removal models of two-body lapping, three-body polishing and abrasive jet machining were established based on the machining mechanism and the numb... 利用平面磨床进行了磨粒喷射精密光整加工实验,实验结果验证了依据机理所建立的材料去除模型,且实验结果和模型吻合很好。
- Keywords Green ceramic balls;Two-grind-wheels shaping;Sphering mechanism;Orthogonal experiment;Grinding mechanism;materials removal mechanism;Surface roughness; 陶瓷球生坯;双砂轮修形;成圆机理;正交试验;磨削机理;材料去除机理;表面粗糙度;
- The material is flawed throughout. 这种材料到处是裂缝。
- This paper briefly describes the plug removal mechanism of hot gas acid and its application in Daqing oil field. 热气酸解堵技术是同时利用酸、热、气、表面活性剂可生成泡沫酸的酸化解堵技术。