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- The analytical results provide theoretical guide to design CMP equipment, select the kinematic variables of CMP and further understand the material removal mechanism of wafer in CMP. 研究结果为设计CMP机床，选择CMP的运动参数和进一步理解CMP的材料去除机理提供了理论依据。
- The dominant material removal mechanisms in grinding of PCD are abrasive wear, fragmentation, thermal-physics and thermal-chemical process. PCD材料去除主要是通过磨粒的机械磨耗、破碎作用和热物理、热化学作用等方式。
- Research on material removal mechanism of fluid jet polishing 液体喷射抛光材料去除机理的研究
- Analysis of material removal mechanism in fluid jet polishing by finite element method 液体喷射抛光技术材料去除机理的有限元分析
- Non-continuum Material Removal Mechanism of Surface Polishing with Ultra Precision 超精密抛光材料的非连续去除机理
- Investigation on Material Removal Mechanism for Abrasive Jet Precision Finishing with Grinding Wheel as Restraint 砂轮约束磨粒喷射精密光整加工材料去除机理研究
- Study on Material Removal Mechanism of Wafer Chemical Mechanical Polishing in IC Manufacturing IC制造中硅片化学机械抛光材料去除机理研究
- Keywords chemical mechanical polishing;planarization;material removal mechanism;model;integrate circuit; 化学机械抛光;平坦化;材料去除机制;模型;集成电路;
- material removal mechanism 材料去除机理
- Scraps or material removed when something is trimmed. 剪削，废料从被修剪的东西上掉下来的碎屑
- Recent Progress in Study on Material Removal Mechanisms of Silicon Wafer During Chemical Mechanical Polishing 半导体芯片化学机械抛光过程中材料去除机理研究进展
- Keywords Green ceramic balls;Two-grind-wheels shaping;Sphering mechanism;Orthogonal experiment;Grinding mechanism;materials removal mechanism;Surface roughness; 陶瓷球生坯;双砂轮修形;成圆机理;正交试验;磨削机理;材料去除机理;表面粗糙度;
- The material removal models of two-body lapping, three-body polishing and abrasive jet machining were established based on the machining mechanism and the numb... 利用平面磨床进行了磨粒喷射精密光整加工实验,实验结果验证了依据机理所建立的材料去除模型,且实验结果和模型吻合很好。
- Floationg material removal of semi clean water and sewage, waste, dirty water. 用于去除生活用下水,废水,污水中的浮游物质。
- Analysis on the Supersonic Vibration Gear Honing Materials Removing Mechanism 超声振动珩齿材料去除机理的初步分析
- This paper briefly describes the plug removal mechanism of hot gas acid and its application in Daqing oil field. 热气酸解堵技术是同时利用酸、热、气、表面活性剂可生成泡沫酸的酸化解堵技术。
- Through analysis of plug removal mechanism using the technique of high-pressure jetting,we design the str... 经现场应用,取得了较好的效果。
- The results are important for the understanding of the mechanism of material removal in the CMP of microelectronic materials. 其结果对于正确理解微电子材料CMP加工中的材料去除机理具有实际意义。
- The material removal volume of wear-resisting cast steel,when ground with the electroplated CBN tools made with ... 在电镀过程中,应严格控制CBN活化表面钯质点的数量,使其保持在合适范围内,避免CBN颗粒相互粘结和成块现象。
- Based on the analysis of microstructure and removal mechanism of PCD, the mechanism of ultrasonic vibration lapping for PCD is investigated. 在分析聚晶金刚石(PCD)材料的微观结构和去除机理的基础上,对PCD材料的超声振动研磨机理进行了深入研究。
