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- TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable. TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
- Kester EnviroMark 808 is a lead free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. 凯斯特EnviroMark 808是一种无铅有机酸水溶性焊锡膏,具有最高等级的一致性和性能。
- Forced convection cooling system to easily reach the requirements of strict lead free soldering processes. 强制冷却系统实现急冷达到无铅焊接工艺的冷却降温要求。
- Soldering materials are our major products, especially in Lead Free Soldering Materials. 焊锡物料是我们的主要产品,特别是无铅焊锡物料。
- The Main products to be exhibited: Lead free soldering machine, nitrogen lead free reflux soldering machine, inserter wire, SMD relative equipment, anti-static series of products. 无铅波峰焊锡机、氮气无铅回流焊锡机、插件线、SMD周边设备、防静电系列产品。
- Lead - free solder paste 无铅焊膏
- Research on the SnAgCu Lead Free Solder with Minute Amount Rare Earth Elements 添加微量稀土元素的SnAgCu无铅钎料的研究
- Research of Activation Temperature of Rosin- Based Flux for Lead- Free Solder Paste 无铅焊膏用松香型助焊剂活化点的研究
- A. Gurav, B. Stacy, Whiskering Evaluation of Capacitors Mounted with Lead Free Solders, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, March 2004. 吴懿平;刘一波;吴丰顺;集成电路引脚无铅覆层的锡须生长抑制;自然科学基金项目申请书;2004.
- Heat stability is more evident with solder paste. 焊锡膏的热稳定性就更为明显。
- Stir solder paste in container before use. 使用时搅拌容器内的焊膏。
- ELEC-MICRO Handbook of Lead Free Solder Technology for Microelectronic Assemblies 微电子组装无铅焊接技术手册
- Keywords lead free solder;alloying element;interfacial reaction;intermetallic compound; 无铅钎料;合金元素;界面反应;金属间化合物;
- * There is found that crack at Intermetallic Compound when mixed solder with Lead Free Solder and Lead Solder. 有铅焊料与无铅焊料混合焊接时,在合金层中发现了裂纹。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小时内回流焊膏。
- The use of nitrogen will depend on the solder paste flux chemistry. 是否使用氮气取决于焊锡膏焊剂的化学特性。
- Is the sequence of Solder Paste height measurements defined? 锡膏厚度的测量顺序是否指定?
- Is the average and range of Solder Paste height measurements SPC controlled? 锡膏厚度测量的平均值和间距SPC是否受控?
- lead free solder 无铅焊料
- lead free solder joint 无铅焊点