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- Keywords Themo-fatigue;Life prediction;Flip chip;Solder joint;Lead free; 热疲劳;寿命预测;倒装芯片焊点;无铅化;
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
- TK0730 is a no-clean type flux cored wire designed for Lead free. TK0730是一种免清洗型焊剂芯焊锡线,适用于无铅应用。
- Your next BEST choice in Lead Free capable reflow oven. 您的下一个最佳的无铅回流焊炉的选择一定是保乐。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
- Please fill up my gasoline tank with lead free premium gas. 请加满油箱-无铅高级汽油。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
- The green cresset is the mark of lead free processing. 绿色灯号是无铅制程标识。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
- Shell Malleus GL is a range of premium quality, lead free. 壳牌马力士GL是一系列优质、不含铅、抗极压的润滑剂.
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.
- Utilization of flip chip as cost-effective interconnect technology requires innovative handling, test methods and processes for KGD. 倒装芯片是一种性能价格比良好的互连技术 ,要求采用富有创新的操作 ,以满足KGD的测试方法和操作工艺的需要。
- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
- TK1030 is a no-clean type flux cored wire NEWLY designed for Lead free. TK1030是一种新近研制的免清洗型焊剂芯焊锡线,适用于无铅应用。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
- TK5930 is a no-clean RMA type flux cored wire designed for Lead free. TK5930是一种免清洗轻度活化松香(RMA)型焊剂芯焊锡线,适用于无铅应用。
- Discuss the necessary of flip chip underfill to ther mal fatigue failures.Put forward controlling parameter for flip chip underfill. [摘要]从热疲劳故障的角度论述了倒装芯片底部填充的必要性 ，介绍了倒装芯片底部填充的参数控制。
- This procdure provides instruction for lead free BGA reballing process. 该程序为无铅。
- Some typical applications in under bump metallurgy(UBM)for flip chip bumping,PC boards,LCRs and computer hard disk are reviewed. 指出,减少污染、延长镀液使用寿命、降低成本仍然是化学镀镍面临的一项长期的任务;
