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- lead free solder joint 无铅焊点
- Keywords Themo-fatigue;Life prediction;Flip chip;Solder joint;Lead free; 热疲劳;寿命预测;倒装芯片焊点;无铅化;
- Forced convection cooling system to easily reach the requirements of strict lead free soldering processes. 强制冷却系统实现急冷达到无铅焊接工艺的冷却降温要求。
- Effect of Cu Surface Finishes of Printed Circuit Board on the Microstructure of Lead - Free Solder Joint 印制电路板铜面保护层对无铅焊点结构影响
- Soldering materials are our major products, especially in Lead Free Soldering Materials. 焊锡物料是我们的主要产品，特别是无铅焊锡物料。
- The Main products to be exhibited: Lead free soldering machine, nitrogen lead free reflux soldering machine, inserter wire, SMD relative equipment, anti-static series of products. 无铅波峰焊锡机、氮气无铅回流焊锡机、插件线、SMD周边设备、防静电系列产品。
- Research on the SnAgCu Lead Free Solder with Minute Amount Rare Earth Elements 添加微量稀土元素的SnAgCu无铅钎料的研究
- A. Gurav, B. Stacy, Whiskering Evaluation of Capacitors Mounted with Lead Free Solders, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, March 2004. 吴懿平;刘一波;吴丰顺;集成电路引脚无铅覆层的锡须生长抑制;自然科学基金项目申请书;2004.
- Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality 冷却速率对无铅钎料和焊点质量影响
- ELEC-MICRO Handbook of Lead Free Solder Technology for Microelectronic Assemblies 微电子组装无铅焊接技术手册
- Keywords lead free solder;alloying element;interfacial reaction;intermetallic compound; 无铅钎料;合金元素;界面反应;金属间化合物;
- * There is found that crack at Intermetallic Compound when mixed solder with Lead Free Solder and Lead Solder. 有铅焊料与无铅焊料混合焊接时，在合金层中发现了裂纹。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此，有必要对这种混合焊点进行可靠性分析。
- lead free solder 无铅焊料
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable. TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
- Kester EnviroMark 808 is a lead free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. 凯斯特EnviroMark 808是一种无铅有机酸水溶性焊锡膏,具有最高等级的一致性和性能。
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- TK0730 is a no-clean type flux cored wire designed for Lead free. TK0730是一种免清洗型焊剂芯焊锡线,适用于无铅应用。
