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- lead frame assembly system 引线框装配系统
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Assembly System: slats stand out of the frame 装配系统:板条上插
- Differential-speed Chain Assembly Line with automatic assembly system featuring with accurate, reliable and quick with blocking. 差速链组装流水线自动化装配系统,具有准备可靠、快捷流畅的特点。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- This dissertation studied several key technology of Virtual Assembly System and accomplished the prototype system development. 本文对虚拟装配的部分关键技术和虚拟装配系统的实现方法进行了分析和研究,完成了原型系统的初步开发。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- The problem environment is an assembly system in which subassemblies are regularly deposited into and retrieved from the AS/RS. 吾人假设本问题环境为一个装配系统,且在此系统的半成品,常常需要被暂时存放于自动仓储系统内。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式,对构装翘曲及晶片应力也有明显改善效果。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- The undercarriage includes an inclined adjustable telescopic means pivoted to the table top and the bottom of the leg frame assembly to enable sliding upwards and downwards movements. 这起落架包含个倾斜的可调整伸缩的配件,枢轴式地接合桌面和脚架装置的底部促使向上和向下的滑动动作。
- An automotive power plant virtual assembly system is used to illustrate the CFM and the modeling approach for directing and accomplishing the VR system design. 文中结合汽车动力总成虚拟装配系统实例介绍了采用综合式框架模型及建模方法指导并实现虚拟现实系统设计。
- FRAME ASSEMBLY OF PICK-UP &BUS AND MANUFACTURINGOF RELATED PARTS. PRESSING &WELDING OF SHEETMETAL PARTS. MANUFACTURING OF PRESSING DIE ANDWELDING JIGS. MANUFACTURING OF WOODEN REAR BODY. 货车、巴士之车架组立及其零件之制造、一般汽车钣金零件之冲压及焊接、钣金冲压模具及焊组治具之制造、货车木制后车身之制造。
- CASL Macro Assembly System (CMAS) is realiged to translates CASL assembly Inguage source programs into 8086 macro assemdly programs on IBM-PC or its compatible computers. 本文介绍了在IBM-PC及其兼容机上实现的一个能将CASL汇编语言源程序转换成8086宏汇编程序的CASL宏汇编系统(CMAS)的实现方法和技术。
- Semiconductor manufacturing:reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀:卷对卷电镀,接触器件电镀,引线框架电镀,电抛光,选择性点镀等
- The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation. 自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
- The Quality of lead frame plating layer directly affects the solderability of tantalum capacitor, so its measuring methods are very important. 引线框架电镀层的质量直接影响着钽电容器的可焊性,所以引线框架电镀层质量的测定方法至关重要。
- The ideal requirement for lead frame material properties is that tensile strength, hardness and electrical conductivity are more than 600MPa, 180HV and 80%IACS respectively. 理想的引线框架材料的主要性能为:抗拉强度在600MPa以上,显微硬度大于180HV,导电率大于80%25IACS。
- The lead frame materials must have high softening temperature because they need to bear short-time high temperature conditions in the process of capsulation. 由于在引线框架材料的后续封装过程中材料需承受短时高温使用条件,所以对其软化温度提出了很高的要求。