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- heavy copper cladding PCB 厚铜箔印制板
- heavy copper cladding printed circuit board 厚铜箔印制板
- SHANGHAI NANYA COPPER CLAD LAMINATE CO., LTD. 上海南亚覆铜箔板有限公司。
- Nanmei Copper Clad Laminate Factory Ltd. 南美覆铜板厂有限公司。
- Copper Clad Laminate and PCB Warpage Test Method 覆铜板和PCB翘曲度的检测方法
- Do you know which is heavier copper or silver? 你知道铜和银哪个重?
- Causes and Prevention of Copper Clad Laminate and PCB Warpage 覆铜板和PCB板翘曲成因与预防措施
- A preliminar application of the polyimide film to two layer flexible copper clad lamination was studied. 对该聚酰亚胺在二层柔性覆铜板上的应用进行了初步研究。
- Keywords： printed circuit board, plated through hole, copper clad laminate, epoxy. 关键词：印刷电路板，贯孔，铜箔基板，环氧树脂
- The copper clad laminate automation system is designed and realized by using Program Logic Controler(PLC). 摘要简要阐述了用可编程控制器(PLC)实现对铜箔覆胶机自动控制的方法。
- I'm looking for a small quantity (only 2 at the moment) of insulated copper clad aluminum wire for an electromagnet project. 我在为一个电磁项目寻找小量（目前只有2根）绝缘铜铝电线。
- After burying copper clad steel grounding pole underground, nomatter natural corrosion or electrochemistry reaction, it has strong protection ability. 铜包钢接地极深埋地下后，无论是自然腐蚀还是电化学反应，都有极强的保护性。
- We have 150 skilled staff,own kinds of advanced special Lacquered Aluminum Wire and Copper Clad Aluminum product equipments,detection devices. 公司员工150人，拥有各种先进的铜包铝、铝漆包线生产专用设备、检测设备叁拾余台（套）。
- The excellent bimetal composite bar of copper cladding aluminum is made, the copper distribution is even in the direction of portrait and circumference. 结果表明:采样充芯连铸法工艺可以连续稳定地制备铜包铝双金属棒,包覆层厚度均匀。
- Sodium silicate churk of casting mould surface posible sending casting surface form inclusion.Alcoholbase bauxite coating to meet the needs of heavy copper casting surface quality. 铸型表面的水玻璃团块可使铸件表面形成夹杂缺陷,用铝钒土醇基快干涂料,可满足大型铜合金铸件对表面质量的要求。
- This paper initially discussed synthesis and modification of tetrafunctional epoxy resin(1,1,2,2- tetrakis(hydroxy phenye)ethane),as well as application in copper clad laminate. 对四官能环氧树脂[1,1,2,2-四(对羟基苯基)乙烷四缩水甘油醚]的合成与改性及在覆铜板中的应用作了初步探讨,并对其屏蔽紫外线与产生荧光的机理作用作了简单阐述。
- Acid, Cu, Cd are the main environmental pollution factors, the plant China Sumac has enrichment and translocation effects to copper, morbid in heavy copper polluted area, it is suit for the recovery. 野外调查、前人成果以及样品的化验分析表明酸、铜、镉等是德兴铜矿地区主要的环境污染因子，盐肤木对铜元素呈现一定的富集作用和很强的位移效应，是适合铜矿复垦的植被，在铜污染严重区出现病态。
- Various polyimide was synthesized from 3-BAPP with various dianhydrides.The application of the polyimiders to two-layer flexible copper clad laminate (2L-FCCL) was researched. 用3-BAPP与多种二酐合成出多种聚酰亚胺，并在二层法挠性覆铜板(2L-FCCL)的应用方面做了一些研究。
- The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced. 论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
- Cyanate compound, the preparation of triazine copper clad panel and 1ts application in high frequency printed circuit board were introduced in this paper. 本文介绍了氰酸酯化合物，三嗪覆铜板的制备及其在高频线路板上的应用。
