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- How to select the suitable heat sink? 如何选择合适的散热片?
- We want to purchas heat sink ,please contact us. 求购温控器，请生产厂家联系我们。
- The main products have brushless DC cooling fan, CPU heat sink, VGA, such as the radiator. 主要产品有直流无刷散热风扇、CPU散热器、VGA散热器等。
- THE NUMERICAL ANALYSIS ON THE HEAT TRANSFER PERFORMANCE OF CPU HEAT SINK COOLED BY VERTICAL UNIFORM JET 垂直均匀射流下CPU散热器换热性能的数值分析
- De-Yang Wu, ” Performance Evaluation of the Heat Sink in a Water Cooling System”, Thesis for Master of Science Department of Mechanical Engineering Tatung University, June 2003. 游裕杰，”离心式电脑风扇的设计与分析”，国立成功大学机械工程学系硕士论文，2002年6月。
- Very high heat sink capacity of the MEPCM was found by DSC method. 最后的dsc热分析表明了MEPCM具有很高的蓄热能力。
- Electronic parts: heat sink copper holder, fiber coupler body. 电子零件：散热器铜座，光纤连结器本体.
- Zhenjiang East Asian heat sink, the transistor, resistor. 镇江东亚散热片，二三极管，电阻。
- Micro-jets impingement cooling heat sink is used to cool the high power LDA owing to the very thin hydrodynamic and thermal boundary layers in the impingement region when a jet impinges on a surface. 微射流阵列冷却热沉,是利用射流冲击在驻点区能产生很薄的边界层来提高换热效率的,合理的布置射流孔,可以极大的提高被冷却表面温度分布的均匀性。
- The paper analyzed and discussed two-dimensional heat sink in theory. 本文对二维的热沉问题进行了理论分析和讨论。
- Cooling of a Side-Pumped Laser Slab by Heat Sink 侧面抽运板状激光介质的热汇冷却
- Power densities that can be tolerated by a gage are strongly related to the specimen which serves as the heat sink. 应变片所能允许的电能密度与起着散热器作用的试件密切相关。
- The micro-channel cooling heat sinks provide a powerful means for dissipating high heat flux in microelectronic devices. 微槽冷却热沉是微电子器件中工作芯片冷却的一种有效措施。
- With such a large heat sink value, FRA can meet the requirement of hypersonic flying machine. 在 80 0℃时 ,两者都具有较高的热沉值 ,分别达到 5 6 9MJ kg和 6 6 0MJ kg ,该热沉值能够满足超高音速飞行器的热管理要求。
- Complex heat sink devices, including liquid cooled cold plates and stacked fins with heat pipes . 复杂的散热器产品，其中包括液体冷却的冷板块和堆叠鳍片与热管。
- Memory part of the comprehensive coverage of the heat sink, but also benefit from overclocking graphics cards. 显存部分全面覆盖了散热片，更益于显卡超频。
- Designed specifically for lead-free, low temperature soldering process, such as heat sink applications. 适用于无铅，低温焊接工艺，例如：散热模组。
- The performance of plate-fin heat sinks under cross flow cooling has been studied experimentally for various Reynolds numbers, fin heights and fin widths. 在直交流型冷却系统中的平板型散热片的效能已做过许多的实验，包括利用不同的雷诺数、散热片的高度和宽度等。
- The motherboard, video cards and heat sink in the system above are all made by no other than ASUS. 主板，显卡和散热系统上面都没有作出以外华硕。
- For constant fin width, the heat sink with the highest fins has the best thermal performance. 在固定散热片宽度的条件下，高度最高的散热片有最佳的散热效果。
