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- grinding process technology 磨加工工艺
- Beijing JZGW Process Technology Co., Ltd. 北京九州格物过程技术有限公司。
- Beijing Tianli Process Technology Co., Ltd. 北京天利流程技术有限公司。
- Very little pressure is required in the grinding process. 磨削加工只需要很小的压力。
- This research is base on the recent technology of grinding process, and then apply the batch etching method to improve the wafer thining. 本研究建立在现行轮磨可达到的薄化基础上，以批次式蚀刻方式将矽晶圆做更进一步的薄化。
- This paper introduced the process technology of resinoid diamond grinding wheel for grinding rare earth permanent magnet materials. 本文介绍了磨稀土永磁材料树脂金刚石砂轮的制作技术。
- Special angled bed for optimum force distribution during the grinding process. 通过特殊的斜床身结构,在磨削加工中优化了力的分布。
- Set up grinding process mathematical model and its computer simulation. 筒辊磨粉磨过程数学模型的建立及其计算机模拟。
- Define and realize the detailed process technology (work stations). 负责确定和实现规定范围的具体工艺(工位)。
- During the grinding process, the grindability of the raw meal was studied. 在粉磨过程中，还对生料进行了初步的易磨性分析。
- The process technology of ion-exchange film in the pharmaceutical indust. 对离子交换膜技术在医药工业中的应用工艺进行探讨。
- Experience with carbide brazing or grinding processes is preferred. 具有碳焊接或碾磨制程经验者优先。
- The process technology of bacteria-fermented Douchi was studied in thi s paper. 对细菌型豆豉的生产工艺作了深入研究。
- Measure the grinding force in grinding process and compute the grinding energy ratio,analyzing the grinding mechanism. 试验还进行了磨削过程中磨削力的测试和比磨削能的计算,分析了陶瓷材料的去除机理。
- Grinding process with roller press is an advanced and matured comminuting technique. 辊压机料床粉磨技术是一项先进而成熟的粉磨技术;
- Study on the processing technology of Pholidota Chinensis Lindl. 石仙桃炮制工艺研究。
- X.Chen ,D.R.Allanson, W.B.Rowe, 1998,“Life cycle model of the grinding process,”Computers in Industry 36 5-11. 陈鸿荣，2002，”磨削能量对磨后工件表面品质的探讨”高雄第一科技大学，硕士论文。
- Processing Technology and Properties of MVQ/ACM Rubber. 硅橡胶/丙烯酸酯橡胶并用胶的加工与性能
- METHODS The processing technology made of wet granulation. 方法采用湿法制粒的制备工艺。
- The steady-state simulation of a closed-circuit grinding process for interparticle breakage using thi... 将本模型用于对粒间粉碎闭路循环的稳态仿真计算,得到的结果与实验室闭路粉碎试验结果拟合得很好。
