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- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装(叩焊芯片)内部实际的电气连接的焊料中的铅。
- An Overview of Non destructive Inspection in Flip Chip Packaging 倒装焊芯片封装中的非接触检测技术
- Flip chip packaging market flips up 倒装芯片封装市场快速增长
- Shear Strength of Flip Chip Packaging Bonded with Anisotropic Conductive Film 倒装芯片各向异性导电胶互连的剪切结合强度
- For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package. 为避免覆晶封装结构中使用底胶填充之限制,且同时保有良好的可靠性,本文提出无底胶附加限制层覆晶封装结构的新概念。
- Integrated circuit Flip Chip package 集成电路板叩焊晶片
- Investigation of Electromigration on Lead-Free Solder Bump in Flip Chip Packaging 倒装芯片技术中无铅凸点电迁移研究
- Flip Chip technology is a typical application. 倒装芯片技术就是其中一个典型应用。
- Measuring Method in Thermal Strain of Flip Chip Package with Solder Joints 球栅阵列倒装焊封装中的热应变值的测试
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
- Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material 倒装焊SnPb焊点热循环失效和底充胶的影响
- The influence of underfill and its material models on the reliability of flip chip package under thermal cycling 底充胶及其材料模型对倒装焊热循环可靠性的影响
- Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate 以氮化铝陶瓷为基板的倒装式封装工艺研究
- 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
- Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced. 介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
- As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps. 当电流通过焊点时,会伴随产生焦耳热效应和电迁移效应。
- A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants. 关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
- The current crowding effect and temperature distributions in flip chip solders are discussed. 本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
- Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC. 采用通用有限元软件MSC.