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- eutectic die bonder 共晶芯片焊接装置
- Eutectic Die Bonding Technology and Its Applications in MEMS Packaging 基于共晶的MEMS芯片键合技术及其应用
- Figure 2 illustrates the fundamental aspects of a die bond. 图2所示为管芯连接的基本结构。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment. SOT-23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- We also develop and manufacture some assembly machines such as automatic die bonder and automatic transistor sorter. 另外，公司还开发制造自动粘片机和晶体管测试分选机等封装测试专用设备。
- The transistor die bonder has been used in the practical project, and proved possessing the virtue of high speed and precision, convenience operation. 研制的高精度三极管粘片机已应用于具体项目中，实验表明其具有速度快、精度高、操作方便等优点。
- The Research of Eutectic Die Attachment Technology 共晶烧结技术的实验研究
- This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author. 本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理 ,并给出了主要设计参数和计算公式。
- On-site implementation of the control system of Die Bonder discussed in this thesis shows that it better achieves the design requirements. 运行调试表明，所研制的粘片整机控制系统较好地达到了设计要求。
- The transistor die bonder has been used in the practical project,and proved possessing the virtue of high speed and precision,convenience operation. 在分析系统结构及工作原理的基础上,着重探讨了三极管粘片机主控制系统、视觉定位系统、晶粒拾取粘接时序控制等关键技术。
- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.The principal design parameters and formula are provided. 本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理,并给出了主要设计参数和计算公式。
- Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. 摘要键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
- First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design. 本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象，再使用工业界常使用的田口式品质设计方法，将填充胶的控制列为品质特性，然后最佳化参数设计。
- You need a strong adhesive to bond wood to metal. 需要强力胶才能把木料粘在金属上。
- This glue makes a good firm bond. 这种胶水粘得很结实。
