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- The Development of Epoxy Molding Materials for IC Packages 集成电路封装用树脂材料的发展动向
- epoxy molding material 环氧树脂模塑材料
- The device is mainly applied for the pre-heating processing for thermo-set resin material such as melamine, epoxy molding compound , bakelite and urea formaldehyde molding powder , etc. 设备主要用于密胺、环氧树脂,酚醛树脂及尿素塑料等热固性材料的加热工序,应用于压缩成型、移送成型、挤出成型等成型工程。
- Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures. 对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。
- To avoid the exposure of the die and its wire or tape bonds to viscous molding material, the premolded package concept was developed. 为了避免管芯裸露出以及引线或带状引线与粘滞的模压材料相粘合,才提出前模压管壳的概念。
- As one kind of semi-automatic Vacuum-thermoforming machine, Chief fitting be used for any hot model molding material. 本机是一种半自动真空吸塑热成型设备,主要适用于任何热塑成型材料。
- The method of polypyrrole (PPy) films being synthesized on the surface of insulating epoxy molding compound (EMC) electronic packaging materials and the shielding effectiveness of PPy film were studied. 研究了将导电聚吡咯(PPy)薄膜制备在绝缘环氧模塑料(EMC)电子封装材料表面的方法,及导电PPy 薄膜的电磁屏蔽效能。
- The present invention provides an economical and efficient flame retardant used for the polycarbonate/polyester molding material. 本发明提供了一种用于聚碳酸酯/聚酯模塑材料的经济高效的阻燃剂。
- Avoid using water-soluble flux during soldering,otherwise,oxidation and deterioration on molding material and metal would be resulted. 应避免使用水溶性助焊剂(俗称松香),否则将加速金属氧化及导致材料发霉。
- The aim of this paper was to clarify whether hexagonal boron nitride (hBN) could be used as a mold material for titanium alloy investment casting. 研究了六方氮化硼作为钛合金熔模精密铸造中面层造型材料的可行性。
- Standard Specification for Epoxy Molding Compounds 环氧基树脂模塑化合物
- Compared with other kind of precise casting processes, FCP can reduce the environment pollution caused by pattern and molding materials as well as realize near net casting. 与其它精密铸造工艺相比,既可实现铸件的近净形化,又避免或降低了模具材料、造型材料对环境带来的压力。
- Study on Arc Spray Molding Material Properties 电弧喷涂模具材料性能研究
- Alma, M. H., M. Yoshioka and N. Shiraishi (1994) New novolak-resin type molding materials from phenolated wood using hydrochloric acid catalyst. Holz als Roh-und Werkstoff 52:38. 张上镇、吴季玲、王升阳(1997)热分析技术在木材化学研究领域之应用林产工业16(1):133-148.
- Compared with other kind of precise casting processes,FCP can reduce the environment pollution caused by pattern and molding materials as well as realize near net casting. 与其它精密铸造工艺相比,既可实现铸件的近净形化,又避免或降低了模具材料、造型材料对环境带来的压力。
- The material is flawed throughout. 这种材料到处是裂缝。
- Preparation of New Type Epoxy Molding Compounds with High Thermal Conductivity 一类新型高导热环氧模塑料的制备
- Extrusion and blow molding material advancements 挤出及吹塑材料的提升
- Epoxy Molding Compound Technology Selection and Reliability Analysis 环氧塑封料的工艺选择及可靠性分析
- The present status and development tendency of Ti casting for dentistry were surveyed from the view of Ti materials, machine and filling mold materials. 从牙科铸钛用钛材、钛机、埋料等方面综述了牙科铸钛技术的现状及发展。