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- The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed. 探讨了次亚磷酸钠体系化学镀镍沉积机理。
- An effective way to reduce phosphorus content in electroless nickel deposits is to use appropriate complexing agents. 降低化学镀镍镀层磷含量的主要方法是选择合适的络合剂。
- Blackening processes for electroless nickel deposits are reviewed. Factors influencing the shades and properties of the layer are described. 综述了化学镀镍层黑化工艺方法，影响膜层黑度的因素以及黑膜的性能特点。
- Triethanolamine was considered as a desirable complexing agent to reduce phosphorus content in electroless nickel deposits applied on polyurethane foam substrate. 对于以聚氨酯海绵为基体的化学镀镍，研究认为，三乙醇胺是较好的选择。
- Electroless Nickel Deposition on Copper substrate of the PCB by Using Solution of the Zinc Catalyst 应用锌溶液催化的印制板铜箔化学镀镍
- Keywords silicon carbide whisker;aluminum;composite;blackening;electroless nickel deposition; 碳化硅晶须;铝;复合材料;发黑处理;化学镀镍;
- electroless nickel deposition 化学镀镍
- It is not an Electroless Nickel Plating. 不是无电镍电镀。
- Xiang YH, Hu WB, Liu XK, etc . Initial Deposition Mechanism of Electroless Nickel Plating on Magnesium Alloys [J]. Trans IMF, 2001, 79 (1): 30-32. 向阳辉胡文彬沈彬等.;镁合金化学镀的初始沉积机制[J]
- The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc. 化学镀镍废液的处理方法主要有化学沉淀法、催化还原法、电解法、离子交换法等。
- The effects of plating time on electroless nickel plating of magnesium alloy AZ51 are studied by deposition rate calculation,plating morphology observing and corrosion resistance test. 采用沉积速率计算、镀镍形貌观察和腐蚀性能测试,研究了镀镍时间对镁合金AZ51直接化学镀镍的影响。
- Direct electroless nickel plating is a method for plating on magnesium alloy. 摘要镁合金直接化学镀镍是其表面处理的一种方法。
- Electroless nickel plating is introduced to metallize the optical fiber probe. 本文提出利用化学镀法对光纤探针表面进行金属化处理。
- Electrodialysis can be used to regenerate electroless nickel plating baths. 应用电渗析技术,再生化学镀镍老化液以降低镀液成本,减少环境污染。
- With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance. 化学镀镍溶液pH值升高,镀层磷含量降低,同时可能生成Ni(OH)2沉淀夹杂在镀层中,从而使电阻升高;
- The third ways of making stencil is electroform. Hole forming by the way of nickel deposit onto the copper cathode. 制作模板的第三种工艺是电铸成型。在这个工艺中，镍沉积在铜质的阴极心上以形成开孔。
- Electroless nickel under immersion gold (ENIG) provides a solderable coating, but is expensive. 浸金下无电镀镍(ENIG)涂层可以提高可焊性,但此方法比较昂贵。
- Proper wetting agent content can accelerate the nickel deposition rate, make the grains finer, and prevent the formation of pinholes obviously. 适量的润湿剂对镀层的沉积具有促进作用，对防止针孔的生成及细化晶粒具有明显的效果。
- Electroless nickel plating on magnesium-lithium alloy was studied,and an appropriate pretreatment was determined. 对镁锂合金化学镀镍进行了研究,确定了合适的前处理工艺。
- Fairweather, W.A., “Electroless nickel plating of magnesium,” Trans.IMF., 75(3), pp. 113-117, 1997. 张永君，”镁及镁合金阳极氧化工业综述”，材料保护，第34卷，第9期，第24-26页，2001。
