您要查找的是不是：
- Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent. 以次亚磷酸钠为还原剂,在压电陶瓷表面进行酸性化学镀镍磷。
- Study on Stabilizers for Amorphous Electroless Nickel Phosphorus Alloy 非晶态化学镀镍磷合金稳定剂研究
- electroless nickel phosphorus 化学镀镍磷
- An effective way to reduce phosphorus content in electroless nickel deposits is to use appropriate complexing agents. 降低化学镀镍镀层磷含量的主要方法是选择合适的络合剂。
- It is not an Electroless Nickel Plating. 不是无电镍电镀。
- Triethanolamine was considered as a desirable complexing agent to reduce phosphorus content in electroless nickel deposits applied on polyurethane foam substrate. 对于以聚氨酯海绵为基体的化学镀镍，研究认为，三乙醇胺是较好的选择。
- The surface brittleness of nickel phosphorus (Ni-P) coatings by electroless plating is investigated with the method of rigidity ball indentation together with the acoustic emission technique. 用刚性球体压入法并结合声发射技术测定了化学镀Ni-P镀层的表面脆性.
- With the raise of pH value of electroless nickel plating solution, content of phosphorus in deposit was lowered, and moreover, Ni(OH)_2 was probably precipitated and mingled with Ni-P deposit which resulted in ascension of resistance. 化学镀镍溶液pH值升高,镀层磷含量降低,同时可能生成Ni(OH)2沉淀夹杂在镀层中,从而使电阻升高;
- Direct electroless nickel plating is a method for plating on magnesium alloy. 摘要镁合金直接化学镀镍是其表面处理的一种方法。
- Electroless nickel plating is introduced to metallize the optical fiber probe. 本文提出利用化学镀法对光纤探针表面进行金属化处理。
- Electrodialysis can be used to regenerate electroless nickel plating baths. 应用电渗析技术,再生化学镀镍老化液以降低镀液成本,减少环境污染。
- Electroless nickel under immersion gold (ENIG) provides a solderable coating, but is expensive. 浸金下无电镀镍(ENIG)涂层可以提高可焊性,但此方法比较昂贵。
- Electroless nickel plating on magnesium-lithium alloy was studied,and an appropriate pretreatment was determined. 对镁锂合金化学镀镍进行了研究,确定了合适的前处理工艺。
- Fairweather, W.A., “Electroless nickel plating of magnesium,” Trans.IMF., 75(3), pp. 113-117, 1997. 张永君，”镁及镁合金阳极氧化工业综述”，材料保护，第34卷，第9期，第24-26页，2001。
- Electroless nickel coating is an important measure for protection of magnesi am alloy. 化学镀镍是镁合金保护的重要手段。
- Electroless Cu, Electroless Nickel and immersion Gold/Silver plating for 3D-MID product with LDS process. 使用激光直接成型加工的3D-MID产品的金属化处理，包括化学镀铜，化学镀镍，化学镀金/银。
- The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed. 探讨了次亚磷酸钠体系化学镀镍沉积机理。
- At the first electroless nickel and then electroplating bright nickel in the tumbler bath was proceeded. 首先,采用化学镀镍;其次,进行滚镀亮镍。
- Ball valve design includes reinforced/enhanced PTFE seats and electroless nickel plated brass ball, blow-out proof pressure retaining stem, and low profile oval handle. 球阀结构包括强化聚四氟乙烯（PTFE）阀座和非电解镍镀层黄铜球体，防吹出压力保持阀杆，以及低矮型椭圆手柄。
