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- On the base of the technology of electroless Ni plating on PET fabric,the electromagnetic shielding dacron fabric of different increasing weight rate was developed. 基于织物化学镀技术,开发出不同增重率的化学镀镍电磁屏蔽涤纶织物。
- The application and prospect of electroless Ni plating in the field of microelectronic device and computer storage are described. 重点阐述了化学镀镍技术在微电子领域的应用,包括UBM制作、印制电路板表面终饰工艺和LCR元件制造,以及在计算机存储领域的应用。
- The metal packaging by anodization is initially des igned, combining with the means of electroless Cu plating some factors were analy zed in the experiments. 本文对这种封装的性能特点进行了介绍,结合化学镀铜金属化方法,以所研制的阳极氧化铝样品为基板进行了金属外壳封装的初步设计,并分析了一些影响因素。
- Process of hard Cr plating on electroless Ni coatings was investigated. Results showed heat treatment and cathodic activation before plating are key technical points. 研究了化学镀镍层上镀硬铬工艺。试验结果表明镀前热处理和阴极活化是其技术关键。
- Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn. 在铁制工艺品上先进行常温化学镀铜然后进行着色处理,获得了效果满意的着色层。
- The metal packaging by anodization is initially des igned,combining with the means of electroless Cu plating some factors were analy zed in the experiments. 本文对这种封装的性能特点进行了介绍,结合化学镀铜金属化方法,以所研制的阳极氧化铝样品为基板进行了金属外壳封装的初步设计,并分析了一些影响因素。
- The performances of Ni three-part alloy layer of elec-troless Ni-P and Ni-B plating and alloy layer of compound electroless Ni plating were described and their application in petrochemical industry was introduced. 对化学镀Ni-P、Ni-B、镍三元合金镀层及其复合化学镍合金镀层的特性进行了论述;对化学镀镍合金在石化工业中的应用进行了介绍.
- The electroless Ni plating on Fe-based powder metallurgy articles was continuously carried out with pretreatments of pore sealing by immersing in zinc stearate in vacuum and ultrasonic cleaning. 采用真空硬脂酸锌浸渍封孔及超声波清洗前处理,对铁基粉末冶金件连续化学镀镍。
- The Ni Cu alloy supported on TiO 2 promote the formation of C 2 hydrocarbons in CO hydrogenation. 双金属Ni、Cu间发生相互作用而形成了均匀的合金相,该活性组分与载体TiO2的共同作用,对CO加氢中C2物种,特别是乙烯的生成有利。
- Study of RE on effect of electroless Ni -P plating 稀土元素在化学镀Ni-P中作用的研究
- Cost and Price for Electroless Ni plating 化学镀镍的成本与价格
- Regeneration of electroless Ni bath by electroosmosis was tentatively investigated through static electroomosis experiment. 通过静态电渗析实验,初步研究了电渗析法对化学镀镍液的再生。
- The Cu that produced by the melting Cu plate in the body can be reduced when the lasering lean to the diamond segment. 铜来源于基体里铜板的熔化,当激光偏向刀头时,铜的含量降低。
- The influences of heat treatment on structure micro hardness, static corrosion resistance in normal temperature and hot solution corrosion resistance of electroless Ni P and Ni Co P alloy coatings were studied. 研究了热处理对化学沉积Ni-P、Ni-Co-P合金镀层的组织结构、显微硬度、常温静态腐蚀性能和热溶液腐蚀性能的影响。
- Ageing of electroless Ni solution is studied showing effects of consumption of salt,reductant and other components on deposition rate. Also shown is effect of componentsaddition on bath life. 研究了化学镀镍液中主盐、还原剂及各组分的消耗量对沉积速度的影响,分析补加镀液的消耗成分以延长化学镀液的使用寿命。
- Al/Fe/Cu multilayers with perfect structure and clear interface were obtained on Cu material by Al plating from molten salt of AlCl_3-NaCl, Fe plating from FeSO_4 solution and Cu plating from CuSO_4 solution in turn. 采用AlCl3 NaCl熔融盐镀铝、FeSO4溶液镀铁、CuSO4溶液镀铜得到了结构完整、界面清晰的Al/Fe/Cu多层薄膜。
- Depositing Processess of Electroless Cu Plating and Properties of Deposit 化学镀铜的沉积过程与镀层性能
- Studying on the Coatings of QFN EMI Shielding by Using Electroless Cu Plating QFN封装电磁屏蔽用化学镀Cu的研究
- Study of the Accelerating Agent for Electroless Ni 化学镀镍加速剂的研究
- Study on Process and Property of Plating of Electroless Ni B Re Alloy 化学镀镍硼稀土合金镀层工艺与性能的研究