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- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- The Choosing Method For Die Bonding Machine 芯片粘接设备的选择策略
- Wafer Quality Detecting System of Automatic Die Bonding Machine 全自动上芯机的晶片检测系统
- Automatic Die Bonding Machine 全自动上芯机
- die bonding machine 上芯机
- Figure 2 illustrates the fundamental aspects of a die bond. 图2所示为管芯连接的基本结构。
- Analyse the application of visual system in COG bonding machine. 针对视觉系统在全自动COG热压焊机中的应用进行分析。
- ZTFB photosensitive seal layer edge bonding machine is a special machine, which uses bonding die cavity to electric perm and spin to avoid ink infiltrate. ZTFB型光敏机印章垫封边机是利用封边模腔对光敏垫周边进行电烫，旋压，使印章与章壳周端边熔为一体，阻止印墨向外渗漏的一种专用机器。
- Applying varieties of work measurement methods, work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 摘要应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- Applying varieties of work measurement methods,work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- A large SMT lines, GRS testing equipment, bonding machine, an independent research and development buildings, perfect after-sales service network products for global sales. 拥有大型的SMT流水线、GRS检测设备、邦定机，拥有独立的研发楼，完善的售后服务网络,产品针对全球销售。
- Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder. 摘要键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
- First, design die bond process because Film BGA substrate must overcome warpage issue, next, use TAGU-CHI DOE method, fillet height control was quality characteristic and optimal parameter design. 本文即先从黏晶制程的机台机构上,设计黏晶制程,克服基板翘曲的现象，再使用工业界常使用的田口式品质设计方法，将填充胶的控制列为品质特性，然后最佳化参数设计。
- The assembly department is having more than 20 assembly lines, 3 sets of bonding machines and 20 sets of ultrasonic welding machines. 装配部有20多条装配线，3套压焊机械和20套超声波焊接机械。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment. SOT-23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- Automatic encapsulating Auto-wire bonding machine 自动分光机
