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- Zinc base die castings are always copper plated in cyanide baths. 锌基合金的压铸件总是在氰化镀液中镀铜。
- Zinc base die castings are always copper plated in cyanide baths . 锌基合金的压铸件总是在氰化镀液中镀铜。
- All connections are gaged to API Spec. and phosphatized or copper plated for anti-galling treatment &resistance to corrosion. 螺纹符合API标准，其表面采用磷化或镀铜的工艺进行处理，以提高其耐腐蚀性和抗粘扣性能。
- Cobalt salt was employed as catalyst precursors,copper plate as substrate and ethanol as carbon source. 采用乙醇催化燃烧法,以钴盐作为催化剂先体、薄铜片作为基底制备碳纳米管。
- Compared with the acid erosion, the copper plate engraving is nontoxic and can help to protect the environment. 铜版干刻技法，首先是它较之酸蚀的无毒，带来了环保的结果。
- During the process of etching (drawing 5), it will use the mixture of ferric chloride, water and copper sulphate, to etch the copper plate. 在该流程的腐蚀步骤中(图5)会利用三氯化铁:水:硫酸铜的混合药水进行与铜版的腐蚀。
- There are two singeing techniques. In the plate technique, the cloth is passed rapidly over a curved copper plate heated to a bright red. 烧毛工艺有两种。在板式烧毛工艺中,织物快速地在一个被加热至通红的曲面铜板上通过
- Forged plated ball core angle valve SIZE 锻压电镀球芯角阀
- Thermography: An imitation of "copper plate engraving" in which a raised image is obtained by printing with a very sticky ink or varnish. 烫凸:是一种仿效“铜版凹印”的方法。先用粘度高的油墨施印
- Copper plate as cathode could guarantee the smooth electrolysis process which had high current efficiency with low cell voltage and lo... 铜作阴极是可行的,既有高的电流效率又有低的溶解性和槽电压,可以保证电解的顺利进行。
- Based on the method of mathematical simulation, the temperature field of mold copper plate has been simulated by the FEM software. 应用数值模拟的方法,采用有限元仿真软件对某钢厂现行使用的结晶器铜板的温度场进行模拟。
- The free electrons move into the saltwater, then into the clean copper plate, into the wire, through the meter, and back to the cuprous oxide plate. 自由电子进入盐水，然后把干净的铜板，到线，通过米，并回到氧化亚铜板。
- A mathematical model has been developed for three-dimensional heat transfer to analyze the temperature field on the cooling copper plate of the thinslab continuous casting mold. 本文描述了连铸机结晶器铜板温度场数学模型,给出了不同工况下铜板温度分布的数值 模拟结果。
- Based on pointmodel between copper plate and mold powder particle and the adhesion theory between friction and copper plate wear,the wearing extent was analyzed. 通过对结晶器铜板与保护渣颗粒微元体接触点模型分析,并结合摩擦与磨损黏附理论分析实际生产中铜板受磨损的影响因素。
- After oxidation treatment, the flake graphite powders were electrolessly copper plated followed by electroless silver plating. 将普通片状石墨粉末经过氧化处理后,先进行化学镀铜再进行化学镀银。
- The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. 分散性好的胶体钯溶液的紫外-可见吸收峰变宽,经过活化可以进行直接电镀。
- Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer. 利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
- Using multi-grade potentiometry to decompose hazardous formic acid in chemical copper plating liquid into CO... 对化学镀铜液中有害的甲酸用多级电位法,使分解为碳酸气与氢。对亚磷酸用过氧化氢氧化为磷酸后呈钙盐去除。
- Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated. 研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜。
- Electroless copper plating is a non-electrolytic method of deposition from solution. 化学镀铜是指不使用电解方法而从槽液中沉积镀铜。
