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- C194 copper alloy is one of the representative materials of lead frame. C194铜合金是最具代表性的引线框架材料之一。
- Pure Copper base material ensures excellent heat dissipation. 纯铜基底确保散热效果。
- This is the most usual aluminum cooler with the copper base. 这是最通常的铝制冷却器与铜基地。
- Any chamber size are available for customer's Lead frame or strip. 可以制作特殊规格的工作室尺寸。
- The single-sided fish defects of KFC copper alloys applied to lead frame produced by domestic corporation were studied and analyzed by energy spectrum analysis, SEM and metallographic analysis. 对国内某企业采用半连续铸造生产的KFC引线框架带材表面鱼鳞状缺陷进行了分析和研究。
- The deformation characteristics of kovar lead and seal ri ng and the copper base are discussed.A suggestion is made on how to improve the design of the base and the reliability of electronic packages. 文中对可伐引线、密封圈的应变特征及其对铜基板热变形的影响进行了讨论，并提出了改善封装热应力的途径。
- The low-profile TLMx100x LED package consists of a reliable lead frame base embedded in a clear epoxy. 超薄TLMx100x封装包含嵌入在清晰环氧树脂中的可靠引线框基盘。
- Reactivity: May react with oxidizing chemicals and strong acids. Corrosive to copper metals and copper based alloys. 可能与氧化性物质及强酸发生反应;腐蚀金属铜及铜基合金。
- Second base lead stearate, Dibasic lead phosphate, efficient organic lead, lead sulfate Tribasic. 二盐基硬脂酸铅、二盐基亚磷酸铅、高效有机铅、三盐基硫酸铅。
- Pure copper base ensures excellent heat dissipation, and anodized aluminum top prevents corrosion. 纯铜基底保证良好的散热效果,阳极电镀铝质上部防止锈蚀。
- Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。
- The wear mechanism of stainless steel against copper based sintered alloy is mainly attributed to adhesion,abrasion and oxidation. 不锈钢/铜基烧结合金材料的磨损机制主要是粘着磨损及氧化磨损。
- At the same time production of IC lead frame, fluorescent display, VFD display, grid and plastic processing business. 同时生产集成电路引线框架、荧光显示屏、VFD陈列、栅网及塑料加工业务。
- Property test of copper based powder metallurgy material was carried out on high temperature frictional fatigue-testing machine. 摘要在高温摩擦疲劳试验机上对铜基粉末冶金材料进行了性能测试。
- The lead frame with the opening in die pad can significantly improve the package warpage and die stresses. 导线架晶片座开槽型式，对构装翘曲及晶片应力也有明显改善效果。
- The results show that distribution of chromium in copper base is improved by homogenizing treatment. 结果表明:均匀化处理可有效改善铬在铜基体中的分布;
- Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production. 粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。
- The heat sink is combined with a copper base for quick heat transfer, and the bottom is also polished to a mirror finish. 散热片铜基底使热量更快散失,且散热片底部经过镜面精加工。
- Semiconductor manufacturing：reel-to-reel plating, pin plating, lead frame plating, deflashing, Spot plating and electro polishing etc. 半导体元器件电镀：卷对卷电镀，接触器件电镀，引线框架电镀，电抛光，选择性点镀等
- The influence of organobentonite on sedimentation ratio, viscosity , thixotropy, film conductivity and micromorphology of the copper based conductive paint is investigated. 研究了有机膨润土防沉剂对铜系导电涂料的沉降率、黏度、触变性、涂层导电性及显微形态的影响。
