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- The aluminum-coating layer was formed on copper substrate with local strain region by using electrodeposition method. 摘要通过电化学方法在带有局域应力的铜表面电镀形成一层铝膜。
- Thermal fatigue property of Ni-based infiltrated layer on copper substrate has been investigated. 研究了铜基表面镍基渗层的热疲劳性能。
- The transient and steady heat transfer performance of the RFHP was experimentally measured and compared with that of copper substrate. 对径向平板热管进行了稳态和瞬态传热性能实验，并与铜基板的实验结果进行了对比。
- Based on developed numerical simulation method,the impacting behavior of copper particle colliding copper substrate in process of transforming material property is investigated. 采用有限元数值计算方法,研究冷喷涂材料改性过程中铜粒子与铜基体非垂直碰撞的变形行为。
- By formation of epoxy coating on n-dodecanethiol self-assembled monolayer on copper substrate, self-assembled monolayer was introduced between epoxy coating and copper electrode. 通过在正十二硫醇自组装单层膜表面制备环氧树脂涂层的方法,在涂层/铜基体界面引入自组装界面层。
- Amorphous carbon and carbon nano-onions are synthesized by carbon ion implantation into copper substrate heated at given temperatures, which is the result of electron beam irradiation. 铜基体上离子注入碳，并经过适当的热处理后，会在其表面析出无定形碳和碳纳米洋葱，这是由电子束的照射作用引发的。
- Fe-based infiltrated layer was prepared on copper substrate through vacuum infiltration casting technology and thermal fatigue property of the Fe-based infiltrated layer was investigated. 摘要用负压铸渗法和制备了铜合金表面铁基渗层并研究了其热疲劳性能。
- Most notably, a permanent hollow hole with a high aspect ratio will be produced on the copper substrate, while copper atoms in close proximity to the hole are only slightly disordered. 利用较短的单壁奈米碳管对铜基板进行深孔加工后，会在铜基板上产生明显的中空孔洞，而孔洞周围的结构只受到非常轻微的影响。
- Electroless Sn on Copper Substrate 铜基上化学镀锡
- The chemical vapor deposition of dia mond films on copper substrates with Ti -Al -Mo intermediate layer was studied. 实验证明,钛-铝-钼过渡层的存在显著提高了金刚石薄膜与铜基底的结合力。
- Preparation of Thick CVD Diamond Film on Copper Substrate 铜基体上CVD金刚石厚膜的制备
- Study on the Cyanide-Free Silver Brush Plating on Copper Substrate 铜基无氰电刷镀银研究
- The chemical symbol for copper is "Cu". 铜的化学符号是Cu。
- What color is copper sulphate solution? 硫酸铜溶液是什么颜色？
- Surface Alloying of Nickel on Copper Substrate by Double Glow Discharge 纯铜双层辉光离子渗镍研究
- Copper and gold are both metals. 铜和金都是金属。
- Copper has less resistance than lead. 铜的电阻比铅的小。
- SURFACE COMPOSITE ON THE COPPER SUBSTRATE FABRICATED BY INFILTRATION CASTING 铸渗法制备铜基表面复合材料
- What color is copper sulfate solution? 硫酸铜溶液是什么颜色？
- A copper coin formerly used in India and Pakistan. 安那旧时在印度和巴基斯坦使用的铜币
