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- Specific monoamine may be added as accelerator into electroless copper plating solution to perform high speed deposition. 在化学镀铜液中添加有特效的一元胺作加速剂可以获得特别快的沉积速度.
- Chemical Analysis of Compositions of Displacement Copper Plating Solution 置换镀铜溶液成分的化学分析
- Determination of trace iron in acid copper plating solution with spectrophotometry 分光光度法测定酸性镀铜液中的微量铁
- Influence of surfactants and polar organics on absorption spectrum and deposition rate of chemical copper plating solution 表面活性剂与极性有机物对化学镀铜的影响
- copper plating solution 镀铜液
- Coat the surface with either nickel or copper (nickel is now generally the preferred commercial process) from an electroless plating solution. 用镍或者铜在无镀电镀液中进行表面处理,目前镍是更流行的商业用工艺。
- Electroless copper plating is a non-electrolytic method of deposition from solution. 化学镀铜是指不使用电解方法而从槽液中沉积镀铜。
- The component data of pearl nickel, bright nickel , acidic copper and brass plating solution in production were analyzed when the best result of the plating deposit obtained . 为了获得电镀的最佳结果,在生产中对珍珠镍、光亮镍、酸性铜和黄铜四种镀液的成分参数进行了统计分析。
- The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. 分散性好的胶体钯溶液的紫外-可见吸收峰变宽,经过活化可以进行直接电镀。
- Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer. 利用比浊法,以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
- Zinc base die castings are always copper plated in cyanide baths. 锌基合金的压铸件总是在氰化镀液中镀铜。
- Using multi-grade potentiometry to decompose hazardous formic acid in chemical copper plating liquid into CO... 对化学镀铜液中有害的甲酸用多级电位法,使分解为碳酸气与氢。对亚磷酸用过氧化氢氧化为磷酸后呈钙盐去除。
- In order to obtain stable brush plating solution and good galvanization performance,various ligands are added. 在刷镀溶液中要加入各种配体,以得到稳定的电镀溶液和较好的电镀效果。
- Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated. 研究了采用次磷酸钠作还原剂在涤纶织物上化学镀铜。
- The ways to prevent iron brush plating solution from being oxidized during storage and working are described. 阐述电刷镀铁液贮存期间和刷镀过程中防氧化的方法。
- Zinc base die castings are always copper plated in cyanide baths . 锌基合金的压铸件总是在氰化镀液中镀铜。
- Method used to remove sodium sulfate and sodium phosphite in the plating solution was given. 随着施镀的进行,化学镀镍液中的硫酸钠和亚磷酸钠的积累越来越多,从而影响镀液的使用寿命。
- A new practical process of alkaline non-cyanide copper plating for preventing carburization was introduced. 介绍了一种实用性防渗碳无氰碱性镀铜新工艺,先进行预镀铜,再进行柠檬酸盐镀铜。
- The process flow and conditions of roughening by copper plating for wrought rolled copper foil were introduced. 介绍了压延铜箔镀铜粗化工艺的工艺流程和工艺条件。
- The experimental results show that the nickel electroless plating solution was stable and the nickel coating obtained with the solutio... 这说明玻璃表面用镍活化以取代用钯活化是一种可行的方法。
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