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- copper ion implantation 铜离子注入
- Effects of the Ion Implantation on Castanea mallissime BL[J]. 引用该论文 项艳;刘正祥;胡蕙露;张良富.
- Amorphous carbon and carbon nano-onions are synthesized by carbon ion implantation into copper substrate heated at given temperatures, which is the result of electron beam irradiation. 铜基体上离子注入碳，并经过适当的热处理后，会在其表面析出无定形碳和碳纳米洋葱，这是由电子束的照射作用引发的。
- There exited two different copper ion in compound 3, Cu (II) and Cu (I). 化合物3中同时存在两种价态的+1和+2价Cu离子，结构为二维贯穿网状结构，相邻的两组贯穿网络结构通过氢键作用连接起来。
- But, stroke speed had no effect on the removal for adsorbing copper ion and cadmium ion. 吸附铜离子和镉离子时，振荡速率对吸附效能完全没有影响。
- The experimental results on fabricating the bipolar ECL silicon IC by ion implantation are reported. 本文简要叙述用离子注入法制造双极硅ECL集成电路的实验结果。
- Thc mutagenic effects of Vc strains by low encrgy ion implantation have been studied. 对低能离子注入Vc生产菌的诱变效应进行研究。
- The distribution of ion implantation dose on the target surface is not uniform, with a peak near the target corner. 注入离子剂量在靶表面的分布不均匀，在边角附近出现峰值；
- Copper and polymerized ferric sulphate were prepared by using scrap iron coils to react with acid wastewater containing copper ion. 利用废铁卷与含铜酸性废水作用制备金属铜和聚合硫酸铁,并用聚合硫酸铁作絮凝剂处理酯化废水。
- A light-sensitive polymer material removed which is used as a mask etching and ion implant steps. 一种暴露于紫外线光即产生聚合作用之抗蚀感光原料，用于化学蚀刻.
- The product mainly secreted in the medium is a bifunctional enzyme with the optimal pH value and concentration of copper ion. 表达产物为双功能酶，分泌至培养基中的酶活力远高于胞内。
- M.Farley, B.Simonton, in “Ion Implantation Science and Technology”, Ion Implantation Technology Co.Yorktown 1996. 宋慧娟等编著，人类与自然科学，五南图书出版公司印行，2003/09。
- The adsorbability and selectivity of the copper ion imprinted polymer is tested by the method of static adsorption and fluidizing adsorption. 采用静态和动态法分析研究铜金属离子印迹聚合物的吸附性能和选择性。
- First, high-current metal ion implantation with the development of a synthesis of metal silicide of new technologies. 首先用强流金属离子注入发展出合成金属硅化物的新技术。
- The application of hydrometallurgical processes which remove copper ion may recovery lots of metals in waste perforated anode and cathode plates. 采用置换除铜湿法工艺可从废旧正、负极穿孔钢带极片中回收多种金属。
- The codeposition of Mo-Ni by electroplating and ion implantation were used to add molybdenum into coatings. 又采用钼-镍合金电镀和离子注入钼+铬硅共渗的方法， 得到了含钼的铬硅渗层。
- The resultsshowed that the order of maximum uptake capacity of copper ion was: 0.6SCA8 >0.6SCA5>0.6SCA2 > 0.1SCA8 >0.1SCA5 >0.1SCA2 >SOP >0.1CA >AOP >0.6CA >OP. 结果还表明;对于铜离子的吸附;不同的吸附剂吸附能力有以下的顺序:0.;6SCA8 > 0
- Copper ions adsorption by beer yeast was studied by AAS,FTIR,SEM/EDS etc. 采用AAS,FTIR,SEM/EDS等方法研究了啤酒酵母对铜离子的吸附作用。
- Abstract: This paper introduces the application and development of ion plating, ionodialysis, ion implantation and the compound technology. 文摘:介绍了离子镀、离子渗、离子注入及其复合工艺的应用与发展。
- On the wafer surface the copper ions settle as a thin layer of copper. 电镀完成后，铜离子沉积在晶圆表面，形成一个薄薄的铜层。
