Electroless composite plating is one of new surface process techniques. 化学复合镀是一种新型表面处理技术。
It was also found that liquid hydrophobic agent microcapsules' content in composite copper coating increased with electrodepositing time. 并且随着电沉积时间的增加,复合镀铜层中憎水剂微胶囊的数量增加。