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- chip component soldering joint 片式元件焊点
- Effects of Stand-off Height between Chip Component and Substrate on Lead-free Solder Joint Reliability 片式元件与基板间隙对无铅焊点可靠性的影响
- Fracture mechanism of lead-free soldered joints of rectangular chip component 矩形片状元件无铅焊点断裂机制
- Whether fatigue of solder joint and the location of the chip are related to the curvature and torsional curvature of PCB are discussed. 芯片焊点寿命的长短和芯片所处位置的曲率和扭率都有关系,但是扭率对寿命的影响总是被忽略。
- W.W. Lee, L.T. Nguyen, and G.S. Selvaduray, “Solder Joint Fatigue Models: Review and Applicability to Chip Scale Packages,” Microelectronics Reliability, Vol. 40, pp. 231-244, 2000. 刘宏毅,金属受随机负载作用下之疲劳分析模式与探讨,国立台湾大学机械工程研究所硕士论文,1998。
- Therefore, it is necessary to study the reliability of this mixed solder joint. 因此,有必要对这种混合焊点进行可靠性分析。
- Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering. “竖碑”现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。
- Therefore,it is necessary to study the reliability of this mixed solder joint. 因此,有必要对形成的混合焊点进行可靠性分析。
- The solder joint exceeds the strength of Type L tube in annealed temper. 这种焊料连接超过退火处理类型L管道的强度。
- Solder end valves are limited by temperatures which affect the strength of the solder joint. 焊接连接端口阀门温度限制在不影响焊接连接端口的强度范围内。
- Saponifier formulations, without proper inhibitors, may attack some metal surfaces, resulting in a dull solder joint. 皂化剂中所含成分,若不采用适当的抑制剂,将会侵蚀金属表面,造成焊点钝化。
- The results by EDX analysis show there was a IMC layer of IMC ((Cu,Ni)6Sn5) at interface of Sn3.8Ag0.7Cu/Ni / Cu and Sn3.8Ag0.7Cu/Ni(P) / Cu soldering joint. Sn3.;8Ag0
- This paper discusses the factors of influencing thermal fatigue of solder joint in SMT and its research method. 本文研讨了影响SMT焊接点热疲劳性能的因素及研究方法。
- Automatic Tape Technology of Chip Component 片式元件自动编带工艺
- The results show that the residual moisture within underfill materials enhances the stress level in solder joint. 结果表明:在湿热环境下,底充胶材料内部残留的湿气提高了焊点的应力水平。
- Chip component rectangle or square end 片状元件、矩形或方形端头
- Important procedures for preparing a solder joint are graphically illustrated in this catalog on page 48. 焊料连接准备工作的重要步骤在本样本第48页中有图文并茂的描述。
- He is a great guy, a chip off the old block. 他是一位好人,就像他父亲一样。
- The quality of solder joint affects the reliability and lifetime of the products produced by SMT directly. 摘要由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性和寿命。
- This kind of material is used to make dielectric filters and miniature, light and chip components for communication equipments in decimeter-wave region. 该材料可用于制作介质滤波器及分米波通信设备用的小型、轻量的片式元器件。
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