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- The project researches the integration of the vision and motion parts of the pre-bonding module of RFID flip chip packaging machine. 本课题受到国家自然科学基金重大项目“先进电子制造中的重要科学技术问题研究”的资助,专门针对RFID倒装芯片封装设备中的预绑定模块进行视觉系统和运动控制集成的研究。
- Xinhua Packaging Factory mainly produces PE protection film , PE stretch film ,PE/PVC electrostatic protection film ,film plastic box composite membrane. 新华包装材料厂专业生产：PE保护膜、PE拉伸膜、PE/PVC静电保护膜、胶片胶盒复合膜。
- Copper Dual Damascene processing for chip metallization, and C4(Flip-chip) technologies of planar array chip packaging interconnection cause the electrochemical technologies place in the most complication processing for chip fabrication processing. Cu芯片金属化的双大马士革处理和面阵列芯片封装互连的C4(倒装)技术使电化学技术置于最复杂的制造工艺技术之间。
- At the same time, China is taking on a grand scale semiconductor expansion plan to become the premier location for silicon foundry services, IC design, chip packaging, and testing. 同时，中国正计划成为主要的芯片生产、IC设计、芯片封装和测试的基地。
- Flip chip packaging market flips up 倒装芯片封装市场快速增长
- There is barbed Sachet 4 rural processing plants, packaging factories l Department, led the development of the township, engaged in the industry of more than 300 personnel. 现建有香包刺乡加工厂4处，包装厂l处，带动全乡从事这一产业开发的人员达300多人。
- He is a great guy, a chip off the old block. 他是一位好人，就像他父亲一样。
- It is now our aim to set up a factory. 我们现在的目的是创办一座工厂。
- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- Based on the IBIS model, a simple method was proposed to estimate the simultaneous switching noise (SSN) of the high-speed chip package. 摘要基于BIS模型，提出了一种新颖、简单地估算高速芯片封装结构同步开关噪声(SSN)的方法。
- The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. 摘要微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。
- Toshiba dubs the peripheral chip package the ‘Super Companion Chip’ that includes audio and image interfaces supporting Cell's high data transfer capability. 日本东芝公司配音周边的薄片包装那 '超级朋友薄片' 那包括支援细胞高的数据移动能力的声音和图像接口。
- Jack was assigned to the assembly shop of the factory. 杰克被分配到厂里的装配间工作。
- Relied on the analysis and discussions of many measures for suppressing the SSN of the package, some design guidelines for the high-speed chip package with low SSN were presented. 基于对多种抑制封装结构SSN措施的分析与讨论，给出了低SSN的高速封装结构设计原则。
- He piloted us through the large factory. 他领我们参观了这个大工厂。
- Finally he got a job shifting rails in a factory. 最后他在一家工厂找到一个搬钢轨的工作。
- An Overview of Non destructive Inspection in Flip Chip Packaging 倒装焊芯片封装中的非接触检测技术
- The average output of the factory is 20 cars a day. 该工厂的平均产量是每天20辆汽车。
- Our factory makes celluloid articles. 我们厂制造赛璐路制品。
