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- Desirable for high-performance Ball Grid Array (BGA) package. 高性能球形焊點陣列封裝需要倒裝焊。
- In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height. 在這個例子里,球柵陣列(BGA)焊膏沉積面積正常,但實際焊膏量大於期望量和期望高度的2倍。
- Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard. 按照JEDEC標準對板級跌落實驗的要求測試了有鉛和無鉛焊點的球柵陣列封裝。
- The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC). 釺料凸台的製造是球柵陣列封裝(BGA, ball grid array)、晶元尺寸級封裝(CSP, chip scale packaging)及倒裝晶元封裝(FC, flip chip)等面陣封裝的關鍵技術之一。
- On the base of ULA (uniform linear array), supposing every ULA as a sub-ULA of 2-D array, different sub-ULA's DOA estimation will be made of DOA estimation of 2-D grid array. 以等距線陣為基礎,把每一線陣作為平面陣列的一個子線陣,信號在不同子線陣上形成的波達方向估計就構成平面陣列的波達方向估計。
- This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process. 中文摘要本文針對陣列錫球封裝產品基板和膠餅間所產生的分層作研究。
- The wafer bumping process in Ball Grid Array (BGA) packaging has three characteristics: long machine setup time, dynamical arrival of orders, and re-entrance of operations. 摘要球格陣列封裝廠具有機台整備時間長、訂單動態來到以及產品會再迴流等三大特性。
- Start to work at FCI since 1998 as Ball grid array (BGA) connectors products marketing manger that was mainly targeted for CPU socket project in Note Book PC application during 1998 to 2000. 1998年加入FCI,1998年至2000年擔任球柵陣列(BGA)連接器產品(該產品主要面向筆記本電腦應用中的CPU插槽)市場經理之職。
- Ball Grid Array Micro Pull Strength 球形柵格陣列微拉力測量
- Low-profile Fine pitch Ball Grid Array 小外型細間距球柵陣列
- The Ball Grid Array and Cleaning 球柵陣列器件及其清洗
- PPGA:(Plastic Pin Grid Array Package) 塑料插針矩陣封裝電腦常用縮略詞(二十)點對點協議
- Enhanced plastic ball grid array 增強型塑料球柵陣列
- Ultra thin Fine pitch Ball Grid Array 超薄細節距球柵陣列
- Metallized Ceramic - Pin Grid Array HPI 金屬化陶瓷-接腳柵格陣列
- CPGA: Ceramic Pin Grid Array Package 陶瓷針柵陣列封裝一點
- Projection of spherical grid on ellipsoid and analysis of its de formation 球面離散網格在橢球面上的擴展及變形分析
- When testing multi-diode devices, such as pin grid arrays or DIP packages, switching is required to connect a single source-measure instrument to each individual diode. 在測試多二極體裝置時,例如針柵陣列矩陣或DIP封裝器件,需要開關來將源測量儀器連接到每個二極體。
- The oil-lamp needs a new globe, spherical lampshade. 這油燈需配個新的圓燈罩。
- PBGA (plastic ball grid array) assembly PBGA組件