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- No-flow underfill materials that cure during the solder reflow process is a relatively new technology. 在精細金屬線條的連鑄過程中,影響鑄件品質的因素很多,所以有必要對不同的操作條件作影響評估。
- An automated optical inspection (AOI) machine can be put anywhere on the line to catch defects, and systems that continuously monitor the thermal profile in solder reflow ovens are becoming popular. 自動光學檢測(AOI)機可安裝在生產線的任意位置,以便捕捉缺陷,而能夠連續監控再流焊爐的熱曲線的設備也越來越流行。
- Once identified, the SMDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. 一旦被確認,SMD可被適當的包裝、貯存和處理已避免在組裝過程中的迴流和/或返修中的熱和機械損傷。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 結果顯示由於引線鍵合工藝、注塑工藝以及迴流焊中封裝體各部分不同的熱膨脹係數引起的熱應力和塑性變形是產生引腳跟斷裂的主要因素。
- Peak soldering reflow temperature also impacts cleaning performance. 再流焊的峰值溫度也會對清洗性能造成影響。
- Suit for reflow and wave flow solder. 適應再流焊與波峰焊。
- Reflow solder paste in 2 hours as soon as possible after printing. 印刷后要在2小時內迴流焊膏。
- Compatible with infrared and vapor phase reflow solder process. 適用於迴流焊接工藝。
- Keywords soldering reflow;wave-soldering;manual soldering; 關鍵詞迴流焊;波峰焊;手工焊接;
- At the same time,experiments on PBGA solder ball laser reflow were carried out. 同時,本文還對PBGA釺料球激光重熔進行了試驗研究。
- vapor phase solder reflow 汽相焊料迴流
- Do not inhale the vapor during reflow. 不要吸入迴流焊時噴出的蒸氣。
- Adapted to the reflow soldering. 適應於迴流焊接。
- Suitable reflow and wave soldering. 適合於迴流焊和波峰焊
- Clear how to measuring reflow and wave profile. 清楚怎樣測量迴流焊和波峰焊溫度曲線。
- SMOBC: Solder mask over bare copper. 一種阻焊層覆蓋裸銅的工藝。
- Type of high density solder mask. 一種高密度焊料掩膜。
- Is there a standard lead-free solder alloy? 是否存在一種標準無鉛焊料合金?
- Heat stability is more evident with solder paste. 焊錫膏的熱穩定性就更為明顯。
- Stir solder paste in container before use. 使用時攪拌容器內的焊膏。