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- At the same time,experiments on PBGA solder ball laser reflow were carried out. 同時，本文還對PBGA釺料球激光重熔進行了試驗研究。
- Now we mainly produce in the fastener product the screw, the nut, from attack, filling piece, series the and so on ball pad product. 現在我們主要生產緊固件產品中的螺絲、螺母、自攻、平墊、彈墊等系列的產品。
- Slumping problem can be prevented during pre-heat. Solder short and capillary solder ball can be kept away. 預熱階段,不會產生塌陷,可大幅改善橋連,微細錫珠等問題。
- After the except ion of the solder ball with failure mode A1, the major failure mode in drop test was mode B3. 扣除掉破壞模式A1的錫球后，掉落衝擊實驗中錫球以破壞模式B3居多；
- This thesis is devoted to the orientation and the detection of the HDD slider when bonded in SBB (solder ball bonding) machine. 本文主要研究SBB(solder ball bonding)機器中硬碟磁頭焊接時的定位和檢測。
- EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias, solder ball and PCB board. EPBGA構裝體由七個部分所組成，分別為散熱板、成形樹脂、晶片、基板、熱通孔、錫球及印刷電路板。
- The analytical results established that a suitable size of Cu stud in a solder ball could effectively enhance the ball's shear strength. 研究結果指出錫球包含適當尺寸之銅凸塊可有效提升錫球剪力強度。
- So it will result in rigidity skin &block and solder balls etc. 產生的後果是：錫膏出現硬皮、硬塊、難熔併產生大量錫球等。
- Abstract: Fabricating methods often used for solder ball in the BGA package were reviewed.UDS （uniform droplet spray）, which is widely investigated was analyzed. 摘 要: 綜合介紹了BGA封裝使用錫球常用製造方法，分析了研究較多的均勻顆粒成型技術的原理。
- In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and 3D mold flow simulation. 文中主要探討了覆晶封裝底膠充填時,錫球、晶元及基板間的流動狀況。
- Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques. 焊錫突點:在晶面向下的黏結技術中用於黏接元件焊盤的圓形焊料球。
- Defects such as bridging, non-wetting, de-wetting and the potential for solder balls can increase. 諸如橋接、不熔濕、反熔濕以及發生焊料結球等缺陷的的可能性可能增加。
- Internally, the device is Pb-free, except for flip-chip high-temperature Pb-based solder balls, currently exempt from RoHS. 在內部,除倒裝法使用的當前豁免於RoHS的高溫含鉛焊球外,該器件不含鉛。
- The Kester 979 Liquid Flux contains a unique blend of activators that promote excellent wetting without solder balls adhering to the solder mask. 凱斯特979液體焊劑含有一種獨有的混合活化劑,可以促進熔濕作用而不使錫球粘附在阻焊模上。
- He jotted down a note on the pad by the telephone. 他在電話機旁的便箋本草草記下一個通知。
- This could cause a variety of solder defects, ranging from solder balling to non-wetting to damaged devices to voiding to charred residues. 這樣會產生許多焊接缺陷，諸如錫球、潤濕不良、破壞元器件、空洞、碳化等。
- When developing profiles through an actual installation, the solder balls must touch the thermocouples throughout the entire process. 當通過實際組裝來開發加熱曲線時，整個工藝過程中焊料球都必須接觸熱電耦。
- The nurse put a clean pad of cotton over his wound. 護士在他的傷口上敷了一塊乾淨的紗布墊。
- The die may have the shape of an elongated rectangle with the solder balls laid out symmetrically to a diagonal to the rectangle. 管芯可具有拉長矩形的形狀，焊球繞著矩形的對角線呈對稱地分佈。
