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- silicon wafer manufacturing technology 晶圓製造技術
- Lithography, as used in the manufacture of ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技術應用到集成電路製造中,就是將掩模版的幾何圖形轉移到矽片表面的工藝過程。
- Hot plate with silicon wafer lowered to heating position. 加熱板與矽晶圓降低至加熱位置。
- Mechanical Test Wafer - A silicon wafer used for testing purposes. 機械測試晶圓片-用於測試的晶圓片。
- Contamination Particulate - Particles found on the surface of a silicon wafer. 沾污顆粒-晶圓片表面上的顆粒。
- Hot plate with silicon wafer in initial configuration (before heating). 加熱板與矽晶圓在啟始狀態(加熱前)。
- SiO2, an insulator, can be formed by oxidation of surface of the silicon wafer. 經凈化的晶棒接著用機械方法切成薄片.;這些切片就叫做晶圓
- A New Method of Resistless Photochemical Etching for Silicon Wafer[J]. 引用該論文 楊傑;劉焰發;村原正隆.
- Contamination Area - An area that contains particles that can negatively affect the characteristics of a silicon wafer. 沾污區域-部分晶圓片區域被顆粒沾污,造成不利特性影響。
- ICs, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer. 光刻技術應用到集成電路製造中,就是將掩模版的幾何圖形轉移到矽片表面的工藝過程。
- Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component. 晶元:單迴路或元件的硅晶元,無引腳的電子元件。
- Test Wafer - A silicon wafer that is used in manufacturing for monitoring and testing purposes. 測試晶圓片-用於生產中監測和測試的晶圓片。
- The influences of technology parameters on silicon wafer surface quality when slicing are studied theoretically. 對鋸切矽片時各工藝參數對切片表面質量的影響規律進行了理論研究。
- A silicon wafer with micro channels and a pyrex glass with hot films have been bonded to form this sensor. 採用硅微加工技術製作微管道,在玻璃上通過濺射方法形成鈦鉑合金熱膜,最後將兩者鍵合封裝,形成埋置了熱膜的封閉微管道。
- The silicon wafer is tacked with tiny pillars that catch abnormal cells that are, in the end, potentially cancerous. 矽片就好像微小的柱子那樣把不正常的細胞釘住,而這些最終將成為潛在的癌細胞。
- This equipment is applied to stripping silicon wafer through heating water to certain temperature. 本設備是將水加熱到一定溫度,用於矽片脫膠的一款設備。
- A silicon wafer chip manufacturer tries to close a deal with a solvent service company. 矽晶片製造廠商努力與一個有償付能力的服務公司談成生意。
- The effect of nitrogen on oxygen precipitate profile in Czochralski (CZ) silicon wafer is investigated. 摘要研究了氮在退火過程中對直拉矽片中的氧沉澱分佈的影響。
- We are interested in buying solar silicon wafer and ingot ,if you have ,please contact us. 長期求購太陽能矽片硅棒,有意者請與我聯繫。
- KEN W. The evolution of silicon wafer cleaning technology[J]. J Electrochem Soc, 1990,137(6):1887. 曹寶成,於新好,馬瑾;等.;用含表面活性劑和螯合劑的清洗液清洗矽片的研究[J]