An integrated circuit, for example, may consist of a silicon die, die attach material, epoxy underfill, mould compound, leads, and lead plating materials. 例如一個集成電路晶元的組成由硅基模，模固定材料，環氧樹脂填充物質，模壓成分，導線，導線鍍層材料。
Controls must be recessed inside the punch or die shoe and facing the operator. 控制開關必須凹入面對操作者一側的沖頭或模座內。
Return springs and rods must be adequately protected from handling damage if they extend beyond the edge of the die shoe. 如果驅動彈簧及鑼稈伸出模座外應充分的保護避免搬運破壞。
Controls must be recessed inside the punch or die shoe and facing the operator. 控制開關必須凹入面對操作者一側的沖頭或模座內。
Return springs and rods must be adequately protected from handling damage if they extend beyond the edge of the die shoe. 如果驅動彈簧及鑼稈伸出模座外應充分的保護避免搬運破壞。
