Superior solderability and resistance to soldering heat. 優良的可焊性及耐熱衝擊性。
There is good dimensional stability in thickness of board and good resistance of thermal stress of PTH.lon migration among PTH is little. 板的厚度方向的尺寸變化小，金屬化孔的耐熱衝擊性好，板的金屬化孔間的耐熱離子遷移性好。
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