Advanced packaged technique

 
       
  • 先进成套技术

Advanced packaged technique的用法和样例:

例句

  1. Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
    介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
  2. Global Advanced Packaging Technology LTD.
    威宇科技测试封装有限公司。
  3. Advanced Package Tool) is a management system for software packages.
    高级包管理工具)是一个软件包的管理系统。
  4. BGA has been the mainstream of the advanced packaging technology of IC industry.
    BGA封装是目前高密度电子封装的主流。
  5. OBJECTIVE To explore the effect of vacuum packaging technique for storing sterilized packs in order to extend the period of valid storing.
    目的探讨应用真空包装技术保存无菌包,以延长无菌包保存的有效期。

Advanced packaged technique的海词问答与网友补充:

提问补充

Advanced packaged technique的相关资料:

临近单词

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