advanced package

 
       
  • 先进封装

advanced package的用法和样例:

例句

  1. Global Advanced Packaging Technology LTD.
    威宇科技测试封装有限公司。
  2. Advanced Package Tool) is a management system for software packages.
    高级包管理工具)是一个软件包的管理系统。
  3. Additionally, several advanced packaging techniques for MEMS: flip chip for MEMS packaging,multichip package and module MEMS are introduced.
    介绍了几种当前先进的MEMS封装技术:倒装焊MEMS、多芯片 (MCP)和模块式封装(MOMEMS)。
  4. BGA has been the mainstream of the advanced packaging technology of IC industry.
    BGA封装是目前高密度电子封装的主流。
  5. KEY JOB DUTIES &RESPONSIBILITIES: 1 Design and develop novel advanced packaging for 10 to 100 gbit optical ass...... ...
    公司名称:菲尼萨光电通讯(上海)有限公司工作地点:上海市发布时间:2009-4-10
  6. L.Heiner, ” Development of Low Loop, Long Length, Hydrostatically Extruded Bonding Wire, ” International Symposium on Advanced Packaging Materials, 1997.
    陈信龙,“当分子变成了一条长链-窥探高分子的微观世界”,科学发展,第359期,1999年11月。

advanced package的海词问答与网友补充:

提问补充

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