adhesive die attachment

 
       
  • 芯片粘附

adhesive die attachment的用法和样例:

例句

  1. Stress analysis under dynamic load showed that the equivalent stress in both the die attachment adhesive and the sealing ring adhesive between the chip and the silicon protective cap decreased with the increase in the elastic modulus of potting resin.
    动态载荷下等效应力分析表明:芯片粘结胶、芯片及其硅盖板之间封接胶环的等效应力随着灌封胶弹性模量(E)的增加而减小;
  2. As for high power device, paste/SSDA is used popular for die attach.
    对那些做大功率器件的客户来说,锡膏或者焊线用来贴芯片比较普遍。
  3. Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation.
    等离子体400和660系列是低压微波等离子体应用于提高模具粘合,引线的焊接,特别是清洗高级的芯片封装。
  4. An integrated circuit, for example, may consist of a silicon die, die attach material, epoxy underfill, mould compound, leads, and lead plating materials.
    例如一个集成电路芯片的组成由硅基模,模固定材料,环氧树脂填充物质,模压成分,导线,导线镀层材料。
  5. This product design for IC assembly die attache process on die bonder machine.
    本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。

adhesive die attachment的海词问答与网友补充:

提问补充

adhesive die attachment的相关资料:

临近单词

目录
应用 附录 查词历史
    更多>>今日热词