adhesive bond strength tester

 
       
  • 粘合强度试验机

adhesive bond strength tester的用法和样例:

例句

  1. Xeno III Adhesive provides bond strength comparable to total etch systems.
    异种三胶粘剂粘结强度可比提供总额蚀刻系统。
  2. Factors Influencing Bonding Strength of API Adhesive Bonded Mongolian Oak
    影响API粘接柞木的强度因子研究
  3. Adhsive viscidity, in addition to directly affect the adhesive in the glued surfaces of wettibility and permeability, is also affecting the bond strength.
    胶粘剂的粘度,除了直接影响胶粘剂在被粘物体表面的润湿和渗透速度之外,也是影响粘结强度的主要因素。
  4. Bond strength is an important parameter for wafer bond.
    键合强度是关系到键合好坏的一个重要参数。
  5. The T10-P is a Tensile strength tester that used for tensile strength, tearing adhesive, Peeling Etc.The content of test report will include test date, test time, max strength, break value Etc.
    本机可测各种材料之拉力

adhesive bond strength tester的海词问答与网友补充:

提问补充

adhesive bond strength tester的相关资料:

临近单词

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