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- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Wire bonding system 引线键合系统
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样，在打线作业时，该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- The paper discusses the selection of the resorcinolfree direct bonding system optimization for rubber to brass plated steel cord. 本文就橡胶与镀黄铜钢丝帘线无间苯二酚最佳直接粘合系统的选择加以评述。
- Nickel coated CBN products are used for resin bond system,the coating ensures good retention in the bond and long life. CBN镀镍产品用于树脂结合剂体系，表面镀层增加了结合剂对CBN晶体的把持力，提高使用寿命。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合，引线的焊接，特别是清洗高级的芯片封装。
- The existence of various defects in the bolt bonding system results in acoustic wave energy attenuation, phase aberration and frequency scattering. 摘要锚固体系中存在不同大小和程度的缺陷时，声波在传播过程中将产生能量衰减、相位突变及频散现象。
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- Titanium coated CBN products are used for vitrified and some high-temperature metal bond system the coating can reduces the destruction by thermal and chemical corrade. CBN镀钛产品用于陶瓷和某些高温结合剂体系，镀层可减弱CBN晶体所受的热破坏和化学侵蚀。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆，2005，应用反应曲面方法求解封装焊线制程微细间距之最佳参数，硕士论文，国立中原大学，中坜。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。
- The Optimization Design of Wire Bonding Force Control System 引线键合力控制系统的优化设计
- The Pin Brazing can be done in inclement weather unlike other versions of bonding systems. 铜焊钉不象其它连接系统在恶劣的气候条件下它也能正常使用。
- In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra-fine-pitch wire bonding. 目前除了需要不断提高键合机硬件性能外，开发满足超细间距引线键合要求且性能稳定的键合工艺十分必要。
- Among them the lowest impedance and the best mechanical quality, it is the first kind type piezoelectric wire bonder. 其中阻抗最低且机械品质最佳的，则是第一种型式的压电打线器。
- Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied. 摘要基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
- project guarantee and bond system 工程保证担保制度
