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- index of wire bonding machine performance 焊线机的绩效指标
- Development of Control System Used in Ultrasonic Al Wire Bonding Machine 超声波铝线自动邦定机控制系统的研制
- Current Status and Prospects of Studies on High Acceleration and High Precision Positioning Stage used in Wire Bonding Machine 引线键合机中高加速度高精度定位平台的研究现状与展望
- Set up an ultrasonic wire bonding laboratory. 成立超声波电子焊接实验室.
- Wire bonding machine 引线键合机
- Analyse the application of visual system in COG bonding machine. 针对视觉系统在全自动COG热压焊机中的应用进行分析。
- Therefore, the suspended part of the second substrate does not swing or shake during wire bonding operation. 这样,在打线作业时,该第二基板的悬空部分不会有摇晃或是震荡的情况。
- Highest cost process, but good corrosion resistance for on-board contact pads and suitable for wire bonding pads for COB designs. 成本最高的工艺,但板上接触式焊盘具有良好的抗腐蚀性,适合用于板上芯片(COB)设计的焊线粘接焊盘。
- Applying varieties of work measurement methods, work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 摘要应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- Plasma systems 400 and 660 are low-pressure microwave plasma systems for cleaning advanced chip packages prior to die attach, wire bond and encapsulation. 等离子体400和660系列是低压微波等离子体应用于提高模具粘合,引线的焊接,特别是清洗高级的芯片封装。
- ZTFB photosensitive seal layer edge bonding machine is a special machine, which uses bonding die cavity to electric perm and spin to avoid ink infiltrate. ZTFB型光敏机印章垫封边机是利用封边模腔对光敏垫周边进行电烫,旋压,使印章与章壳周端边熔为一体,阻止印墨向外渗漏的一种专用机器。
- Dicing Saw, Wire Bonder, Die Bonder and Spare Part... 划片机、焊片机、焊线机、上蕊机、封装等二手设备...
- This article briefly introduce the key process in semiconductor assembly-ultrasonic wire bonding, about its theory, application area and key technology. 简要介绍了半导体封装过程中的关键工艺--超声波压焊工艺的原理,应用范围和主要关键技术;
- Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced. 介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料,包括金丝、铜丝和铝丝。
- Applying varieties of work measurement methods,work study on Weiber R6C full automatic linear edge bonding machine of some enterprise was carried through. 应用多种作业测定方法对板式家具生产中使用的威霸R6C全自动直线封边机进行了作业研究。
- A large SMT lines, GRS testing equipment, bonding machine, an independent research and development buildings, perfect after-sales service network products for global sales. 拥有大型的SMT流水线、GRS检测设备、邦定机,拥有独立的研发楼,完善的售后服务网络,产品针对全球销售。
- This product design for IC assembly die bonding process on die bonder machine. 本产品是为IC封装自动贴片机及其贴片工艺而设计。
- M.Mahaney, M.Shell, R.Storde, 1991, Use of the in-process bond shear test for predicting gold wire bond failure modes in plastic packages, IEEE IRPS, pp44-51, 1991. 陈永庆,2005,应用反应曲面方法求解封装焊线制程微细间距之最佳参数,硕士论文,国立中原大学,中坜。
- This product design for IC assembly die attache process on die bonder machine. 本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
- The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack. 结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。