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- Structure designing and key processing technologies for wafer level package(WLP) were studied. 对圆片级封装(WLP)的结构设计和关键工艺技术进行了研究;
- Research of gold bump for wafer level package 用于圆片级封装的金凸点研制
- Wafer level package (WLP) 圆片级封装
- Lead-Free Solder Bumping Technology for Wafer Level Package 圆片级封装的无铅焊料凸点制作技术研究
- Wafer level packaging (WLP) 圆片级封装
- The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package 制作圆片级封装凸焊点的垂直喷镀机研制
- Wafer level package 圆片级封装
- Keywords Microelectronics packaging;Chip size package;Wafer level package;Electroplating;Solder bumping; 微电子封装;芯片级封装;圆片级封装;电镀;凸点制备;
- Keywords High-g MEMS accelerometer, wafer level packaging, modal analysis, response analysis,BCB; 高量程MEMS加速度计;圆片级封装;模态分析;响应分析;BCB;
- wafer level packaging 圆片级封装
- One should cover the resistance with metal layer, to avoid the damaged during the wafer level testing. 用金属覆盖电阻,避免wafer级测试时的损伤。
- Ultrathin Wafer Level Chip Size Package Technology 超薄型圆片级芯片尺寸封装技术
- Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level. 静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
- Wafer Level Chip Size Package Technology and its Applications 晶圆级芯片尺寸封装技术及其应用
- Dual In-line Memory Module with Wafer Level Chip Scale Package 在内的芯片组大厂注意而成为内存模块新标准。晶圆级封装的内存模块
- Wafer Level Die Attach Film (WLDAF) Lamination 晶圆级芯片贴装薄膜贴覆
- I'd like a room on the upper level. 我想要楼上的房间。
- We need a mechanical digger to level the ground. 我们需要一台挖掘机来平整土地。
- I hope you'll be on the level with me. 我希望你对我坦率布公。
- She needs to win this point to level the score. 她要赢得这一分才能将比分扳平。
