This thesis is focus on the problem of warpage in flip-chip package due to the CTE mismatch between die, substrate, and bump using various underfill materials.

• 中文摘要本论文针对覆晶封装制程中，因为晶片、基板、凸块和底胶材料都之不同，当温度变化时，所产生的热膨胀效应使得整个封装出现翘曲变形的现象。