This paper reviews our recent work on FSG etching in the dual-damascene technology. The whole etching process consists of four steps, VIA etch, BARC etch, trench etch and nitride remove. Major issues during each step are also discussed in details.

• 文章研究无中间层双大马士革中FSG刻蚀技术,将刻蚀过程细分为四步实施:VIA通孔刻蚀、BARC刻蚀、Trench沟槽刻蚀和阻挡层刻蚀(Nitride Remove),解决刻蚀过程中出现的主要问题。