Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding without the application of an electric field or complicated pre-bond cleaning procedure.

• 晶圆键合技术最吸引人之处是在于创作出各式复合式不同材质的晶圆基板，但是相异材料的热膨胀系数所造成的热应力，使晶圆对无法进行后续的热处理制程。