The traditional(outer) diameter(OD) and inner diameter(ID) cutter can not meet the needs of the large size,small kerf-loss,high quality and (efficiency) of silicon wafer slicing.

• 随着半导体行业的发展,尤其是太阳能电池对大直径硅片的需求不断增加,对硅片的切割精度要求越来越高。