The solderability of benzimidazole films on the surface of copper is investigated by solder float test.Several factors which influence solderability of the films are discussed.

• 摘要 采用上锡率法研究了咪唑化合物在铜表面所成保护膜的可焊性,并探讨了咪唑化合物类型、膜厚、再流焊次数及高温热冲击对该膜可焊性的影响。