The results showed a marked improvement of the thermal performance which CVD-diamond substrates in stacked MCM which is obviously superior than AlN substrates,the maximum heat dissipation is up to 120W under forced air-cooling conditions.

• 结果显示金刚石基板应用在多芯片组件中能显著地改善3D-MCM封装的散热性能,明显优于氮化铝基板; 在强制空冷时散热功率可达到120W。