The results prove that the throwing power of the process is better than that of cyanic copper plating, and the deposits h...

• 结果表明,本工艺的深镀能力优于氰化镀铜工艺,得到的镀层经烘烤和弯曲试验均无脱皮、起泡现象,镀层与基体结合良好。